In late 2008, an international consortium for development of vertically integrated (3D) readout electronics was created to explore features available from this technology. In this paper, the OMEGAPIX circuit is presented. It is the first front-end ASIC prototype designed at LAL in 3D technology. It has been submitted on May 2009. At first, a short reminder of 3D technology is presented. Then the IC design is explained: analogue tier, digital tier and testability
