Paul, Clayton R

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Introduction toElectromagneticCompatibilitySecond EditionCLAYTON R. PAULDepartment of Electrical and Computer Engineering, School of Engineering,Mercer University, Macon, Georgia and Emeritus Professor of ElectricalEngineering, University of Kentucky, Lexington, KentuckyContentsPreface	xvi i1 Introduction to Electromagnetic Compatibility (EMC) 11 .1 Aspects of EMC 31.2 History of EMC 101 .3 Examples 121.4 Electrical Dimensions and Waves 141 .5 Decibels and Common EMC Units 231 .5 .1 Power Loss in Cables 321 .5 .2 Signal Source Specification 37Problems 43References 482 EMC Requirements for Electronic Systems 492.1 Governmental Requirements 502.1 .1 Requirements for Commercial Products Marketedin the United States 502.1 .2 Requirements for Commercial Products Marketedoutside the United States 552.1 .3 Requirements for Military Products Marketed in theUnited States 602.1 .4 Measurement of Emissions for Verification of Compliance 622.1.4.1 Radiated Emissions 642.1 .4.2 Conducted Emissions 672.1 .5 Typical Product Emissions 722.1 .6 A Simple Example to Illustrate the Difficulty in Meetingthe Regulatory Limits 78viii CONTENTS2.2	Additional Product Requirements2 .2 .1 Radiated Susceptibility (Immunity)2.2.2 Conducted Susceptibility (Immunity)2.2.3 Electrostatic Discharge (ESD)2.2.4 Requirements for Commercial Aircraft2.2.5 Requirements for Commercial Vehicles2 .3 Design Constraints for Products2.4 Advantages of EMC DesignProblemsReferences798181818282828486893 Signal Spectra-the Relationship between the Time Domain andthe Frequency Domain 913.1 Periodic Signals 913 .1 .1 The Fourier Series Representation of Periodic Signals 943.1 .2 Response of Linear Systems to Periodic Input Signals 1043 .1 .3 Important Computational Techniques 1113.2 Spectra of Digital Waveforms 1183.2.1 The Spectrum of Trapezoidal (Clock) Waveforms 1183.2.2 Spectral Bounds for Trapezoidal Waveforms 1223.2.2 .1 Effect of Rise/Falltime on Spectral Content 1233.2.2.2 Bandwidth of Digital Waveforms 1323.2.2.3 Effect of Repetition Rate and Duty Cycle 1363.2.2.4 Effect of Ringing (Undershoot/Overshoot) 1373.2.3 Use of Spectral Bounds in Computing Bounds on theOutput Spectrum of a Linear System 1403.3 Spectrum Analyzers 1423.3 .1 Basic Principles 1423.3.2 Peak versus Quasi-Peak versus Average 1463.4 Representation of Nonperiodic Waveforms 1483.4 .1 The Fourier Transform 1483.4.2 Response of Linear Systems to Nonperiodic Inputs 1513.5 Representation of Random (Data) Signals 1513.6 Use of SPICE (PSPICE) In Fourier Analysis 155Problems167References1754 Transmission Lines and Signal Integrity 1774.1 The Transmission-Line Equations 1814.2 The Per-Unit-Length Parameters 1844.2.1 Wire-Type Structures 1865CONTENTS ix4.2.2 Printed Circuit Board (PCB) Structures 1994.3 The Time-Domain Solution 2044.3 .1 Graphical Solutions 2044.3 .2 The SPICE Model 2184.4 High-Speed Digital Interconnects and Signal Integrity 2254.4.1 Effect of Terminations on the Line Waveforms 2304.4.1.1 Effect of Capacitive Terminations 2334.4.1.2 Effect of Inductive Terminations 2364.4.2 Matching Schemes for Signal Integrity 2384.4.3 When Does the Line Not Matter, i .e ., When is MatchingNot Required? 2444.4.4 Effects of Line Discontinuities 2474.5 Sinusoidal Excitation of the Line and the Phasor Solution 2604.5.1 Voltage and Current as Functions of Position 2614.5.2 Power Flow 2694.5.3 Inclusion of Losses 2704.5.4 Effect of Losses on Signal Integrity 2734.6 Lumped-Circuit Approximate Models 283Problems 287References 297Nonideal Behavior of Components 2995.1 Wires 3005.1 .1 Resistance and Internal Inductance of Wires 3045.1 .2 External Inductance and Capacitance of Parallel Wires 3085 .1 .3 Lumped Equivalent Circuits of Parallel Wires 3095.2 Printed Circuit Board (PCB) Lands 3125.3 Effect of Component Leads 3155.4 Resistors 3175.5 Capacitors 3255.6 Inductors 3365.7 Ferromagnetic Materials-Saturation and Frequency Response 3405.8 Ferrite Beads 3435.9 Common-Mode Chokes 3465.10 Electromechanical Devices 3525 .10.1 DC Motors 3525 .10.2 Stepper Motors 3555.10.3 AC Motors 3555 .10.4 Solenoids 3565.11 Digital Circuit Devices 3575.12 Effect of Component Variability 3585.13 Mechanical Switches 3595.13.1 Arcing at Switch Contacts 360x CONTENTS5 .13.2 The Showering Arc 3635.13.3 Arc Suppression 364Problems 369References 3756 Conducted Emissions and Susceptibility 3776.1 Measurement of Conducted Emissions 3786.1 .1 The Line Impedance Stabilization Network (LISN) 3796.1 .2 Common- and Differential-Mode Currents Again 3816.2 Power Supply Filters 3856.2 .1 Basic Properties of Filters 3856.2.2 A Generic Power Supply Filter Topology 3886.2.3 Effect of Filter Elements on Common- andDifferential-Mode Currents 3906.2.4 Separation of Conducted Emissions into Common-and Differential-Mode Components forDiagnostic Purposes 3966.3 Power Supplies 4016.3 .1 Linear Power Supplies 4056.3 .2 Switched-Mode Power Supplies (SMPS) 4066.3 .3 Effect of Power Supply Components on ConductedEmissions 4096.4 Power Supply and Filter Placement 4146.5 Conducted Susceptibility 416Problems 416References 4197 Antennas 4217 .1 Elemental Dipole Antennas 4217.1 .1 The Electric (Hertzian) Dipole 4227.1 .2 The Magnetic Dipole (Loop) 4267.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas 4297.3 Antenna Arrays 4407.4 Characterization of Antennas 4487 .4 .1 Directivity and Gain 4487 .4.2 Effective Aperture 4547 .4 .3 Antenna Factor 4567 .4.4 Effects of Balancing and Baluns 4607 .4.5 Impedance Matching and the Use of Pads 4637.5 The Friis Transmission Equation 4667.6 Effects of Reflections4707 .6 .1 The Method of Images 470CONTENTS xi7 .6.2 Normal Incidence of Uniform Plane Waves on Plane,Material Boundaries 4707.6.3 Multipath Effects 4797.7 Broadband Measurement Antennas 4867.7.1 The Biconical Antenna 4877 .7.2 The Log-Periodic Antenna 490Problems 494References 5018 Radiated Emissions and Susceptibility 5038.1 Simple Emission Models for Wires and PCB Lands 5048 .1 .1 Differential-Mode versus Common-Mode Currents 5048 .1 .2 Differential-Mode Current Emission Model 5098 .1 .3 Common-Mode Current Emission Model 5148 .1 .4 Current Probes 5188 .1 .5 Experimental Results 5238.2 Simple Susceptibility Models for Wires and PCB Lands 5338 .2 .1 Experimental Results 5448 .2.2 Shielded Cables and Surface Transfer Impedance 546Problems 550References 5569 Crosstalk 5599.1 Three-Conductor Transmission Lines and Crosstalk 5609.2 The Transmission-Line Equations for Lossless Lines 5649.3 The Per-Unit-Length Parameters 5679 .3 .1 Homogeneous versus Inhomogeneous Media 5689.3.2 Wide-Separation Approximations for Wires 5709 .3.3 Numerical Methods for Other Structures 5809.3.3.1 Wires with Dielectric Insulations(Ribbon Cables) 5869.3.3.2 Rectangular Cross-Section Conductors(PCB Lands) 5909.4 The Inductive -Capacitive Coupling Approximate Model 5959.4.1 Frequency-Domain Inductive-Capacitive CouplingModel 5999.4.1 .1 Inclusion of Losses : Common-ImpedanceCoupling 6019.4.1.2 Experimental Results 6049.4.2 Time-Domain Inductive -Capacitive Coupling Model 6129.4.2.1 Inclusion of Losses : Common-Impedance Coupling 6169.4.2.2 Experimental Results 617xii CONTENTS9.5 Lumped-Circuit Approximate Models 6249.6 An Exact SPICE (PSPICE) Model for Lossless, Coupled Lines 6249.6.1 Computed versus Experimental Results for Wires 6339.6.2 Computed versus Experimental Results for PCBs 6409.7 Shielded Wires 6479 .7 .1 Per-Unit-Length Parameters 6489 .7 .2 Inductive and Capacitive Coupling 6519.7.3 Effect of Shield Grounding 6589.7.4 Effect of Pigtails 6679.7.5 Effects of Multiple Shields 6699.7.6 MTL Model Predictions 6759.8 Twisted Wires 6779 .8 .1 Per-Unit-Length Parameters 6819 .8 .2 Inductive and Capacitive Coupling 6859 .8 .3 Effects of Twist 6899 .8 .4 Effects of Balancing 698Problems 701References 71010 Shielding 71310.1 Shielding Effectiveness 71810.2 Shielding Effectiveness : Far-Field Sources 72110.2.1 Exact Solution 72110.2.2 Approximate Solution 72510.2.2.1 Reflection Loss 72510.2.2.2 Absorption Loss 72810.2.2.3 Multiple-Reflection Loss 72910.2.2.4 Total Loss 73110.3 Shielding Effectiveness : Near-Field Sources 73510.3 .1 Near Field versus Far Field 73610.3 .2 Electric Sources 74010.3 .3 Magnetic Sources 74010.4 Low-Frequency, Magnetic Field Shielding 74210.5 Effect of Apertures 745Problems 750References 75111 System Design for EMC 75311 .1 Changing the Way We Think about Electrical Phenomena 75811 .1 .1 Nonideal Behavior of Components and theHidden Schematic 75811 .1.2 "Electrons Do Not Read Schematics" 763CONTENTS xiii11 .1 .3	What Do We Mean by the Term "Shielding"? 76611 .2 What Do We Mean by the Term "Ground"? 76811 .2.1 Safety Ground 77111 .2.2 Signal Ground 77411 .2.3 Ground Bounce and Partial Inductance 77511 .2.3 .1 Partial Inductance of Wires 78111 .2.3.2 Partial Inductance ofPCB Lands 78611 .2.4 Currents Return to Their Source on the Paths of LowestImpedance 78711 .2.5 Utilizing Mutual Inductance and Image Planes to ForceCurrents to Return on a Desired Path 79311 .2.6 Single-Point Grounding, Multipoint Grounding, andHybrid Grounding 79611 .2.7 Ground Loops and Subsystem Decoupling 80211 .3 Printed Circuit Board (PCB) Design 80511 .3.1 Component Selection 80511 .3.2 Component Speed and Placement 80611 .3.3 Cable I/O Placement and Filtering 80811 .3.4 The Important Ground Grid 81011 .3.5 Power Distribution and Decoupling Capacitors 81211 .3.6 Reduction of Loop Areas 82211 .3.7 Mixed-Signal PCB Partitioning 82311 .4 System Configuration and Design 82711 .4.1 System Enclosures 82711 .4.2 Power Line Filter Placement 82811 .4.3 Interconnection and Number of PrintedCircuit Boards 82911 .4.4 Internal Cable Routing and Connector Placement 83111 .4.5 PCB and Subsystem Placement 83211 .4.6 PCB and Subsystem Decoupling 83211 .4.7 Motor Noise Suppression 83211 .4.8 Electrostatic Discharge (ESD) 83411 .5 Diagnostic Tools 84711 .5.1 The Concept of Dominant Effect in the Diagnosis ofEMC Problems 850Problem 856References 857Appendix A The Phasor Solution Method 859A.1 Solving Differential Equations for Their Sinusoidal,Steady-State Solution 859AV CONTENTSA.2 Solving Electric Circuits for Their Sinusoidal,Steady-State Response 863Problems 867References 869Appendix B The Electromagnetic Field Equations and Waves 871B.1 Vector Analysis 872B.2 Maxwell's Equations 881B .2 .1 Faraday's Law 881B .2.2 Ampere's Law 892B.2.3 Gauss' Laws 898B.2.4 Conservation of Charge 900B.2.5 Constitutive Parameters of the Medium 900B .3 Boundary Conditions 902B .4 Sinusoidal Steady State 907B .5 Power Flow 909B.6 Uniform Plane Waves 909B .6 .1 Lossless Media 912B.6.2 Lossy Media 918B.6.3 Power Flow 922B.6.4 Conductors versus Dielectrics 923B.6.5 Skin Depth 925B .7 Static (DC) Electromagnetic Field Relations-a Special Case 927B.7.1 Maxwell's Equations for Static (DC) Fields 927B.7.1.1 Range ofApplicability forLow-Frequency Fields 928B.7 .2 Two-Dimensional Fields and Laplace'sEquation 928ProblemsReferences 930939Appendix C Computer Codes for Calculating the Per-Unit-Length(PUL) Parameters and Crosstalk of MulticonductorTransmission Lines 941C.1 WIDESEPYOR for Computing the PULParameter Matrices of Widely Spaced Wires 942C .2 RIBBONYOR for Computing the PUL ParameterMatrices of Ribbon CablesC.3 PCB .FOR for Computing the PUL Parameter947Matrices of Printed Circuit Boards 949CONTENTS xvC.4 MSTRP.FOR for Computing the PUL ParameterMatrices of Coupled Microstrip Lines 951C.5 STRPLINEYOR for Computing the PULParameter Matrices of Coupled Striplines 952C.6 SPICEMTL .FOR for Computing a SPICE(PSPICE) Subcircuit Model of a Lossless,Multiconductor Transmission Line 954C.7 SPICELPI.FOR For Computing a SPICE (PSPICE)Subcircuit of a Lumped-Pi Model of a Lossless,Multiconductor Transmission Line 956Appendix D A SPICE (PSPICE) Tutorial 959D .1 Creating the SPICE or PSPICE Program 960D.2 Circuit Description 961D .3 Execution Statements 966D.4 Output Statements 968D .5 Examples 970References 974Index 975

Introduction to Electromagnetic Compatibility

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