Development of thermal control methods for specialized components and scientific instruments at very low temperatures (follow-on)

Abstract

Many payloads currently proposed to be flown by the space shuttle system require long-duration cooling in the 3 to 200 K temperature range. Common requirements also exist for certain DOD payloads. Parametric design and optimization studies are reported for multistage and diode heat pipe radiator systems designed to operate in this temperature range. Also optimized are ground test systems for two long-life passive thermal control concepts operating under specified space environmental conditions. The ground test systems evaluated are ultimately intended to evolve into flight test qualification prototypes for early shuttle flights