Recent developments in polyimide adhesives at NASA-Langley Research Center

Abstract

Adhesive development is directed towards elevated temperature applications (200-300 C). Because of thermal stability considerations, the most attractive adhesives for this temperature range are linear and addition polyimides. The linear polymide adhesive research encompassed basic structure-property relationships, solvent studies and formulations to meet various requirements. The most recent research in linear polyimide systems was in the development of thermoplastic systems in an effort to eliminate the undesirable evolution of water classically associated with the cure going through an amide-acid intermediate step in the cure process. Addition polyimide adhesive research was undertaken in order to avoid water evolution during cure. Basic structure-property relationships for these materials led to an adhesive which was used extensively for high temperature adhesive needs. Since addition systems are of a highly crosslinked nature, they are not as resistant to impact as their linear counterparts. In order to overcome this problem, research was done in the area of elastomer-toughening these polymers