research
Flexible substrate for printed wiring
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Abstract
A very flexible substrate for printed wiring is disclosed which is composed of a blend of phenoxy resin-polyisocyanate-brominated epoxy resin in which the equivalent ration of the functional groups is hydroxyl grouped: isocyanate group: epoxy group = 1:0.2 to 2:0.5 to 3. The product has outstanding solder resistance and is applied to metal without using adhesives
