The objective of the research project described is to define and demonstrate methods to advance the state of the art of pressure sensors for the space shuttle main engine (SSME). Silicon piezoresistive technology was utilized in completing tasks: generation and testing of three transducer design concepts for solid state applications; silicon resistor characterization at cryogenic temperatures; experimental chip mounting characterization; frequency response optimization and prototype design and fabrication. Excellent silicon sensor performance was demonstrated at liquid nitrogen temperature. A silicon resistor ion implant dose was customized for SSME temperature requirements. A basic acoustic modeling software program was developed as a design tool to evaluate frequency response characteristics

Anderson, P. J.

Gustafson, G.

Nussbaum, P.

English

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https://ntrs.nasa.gov/search.jsp?R=19840024878 2020-03-20T20:46:42+00:00Z
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RESEARCH PRESSURE INSTRUMENTATION
FOR
NASA SPACE SHUTTLE MAIN ENGINE
NASA CONTRACT NO. NAS8-34769
MODIFICATION NO. 5
MONTHLY REPORT	 r
GEORGE C. MARSHALL SPACE FLIGHT CENTER i
MARSHALL SPACE FLIGHT CENTER, ALABAMA 35812
June 1984
Prepared By.
P.J. ANDERSON, PROGRAM MANAGER
P. NUSSBAUM, TECHNICAL DIRECTOR
G. GUSTAFSON, DEPUTY TECHNICAL DIRECTOR	
i
.	 1
i
HONEYWELL INC.
SOLID STATE ELECTRONICS DIVISION
12001 STATE HIGHWAY 55
PLYMOUTH, MN 55441
a.
	
-	 _---
u^a
HONEYWELL INC.
SOLID STATE ELECTRONICS DIVISION
CONTRACT NO. NAS8-34769
MODIFICATION NO. 5
RESEARCH OF PRESSURE INSTRUMENTaATION FOR NASA SPACE SHUTTLE MAIN ENGINE
Monthly R $ D Progress Reprirt June 1984 - Report No. 9
A. Technical Progress and Plans
- See attachment 'A'
B. Schedule	 9
- See attachment 'B'
C. Status of Funds
Total Baseline Plan
Total Funded
Cost Incurred to 8/01/84
Inception to Date Plan
Estimate at Completion
LBM
$407,350
$300,000
$246,021
$204,635*
$407,350
D. Estimated percent of physical completion:
	
60%
E. At the present time the comparison of the cumulative costs to the percent
of physical completion does not reveal any significant variance requiring
explanation.
* These numbers for April and May were incorrectly reported. The reported
and corrected numbers are as follows:
April
• Reported	 $211,286	 $217,600
• Corrected
	
$1960896	 $203,070
L,
0
I
ATTACHMENT 'A'
RESEARCH PRESSURE INSTRUhENTATION
FOR
NASA SPACE SHUTTEL MAIN ENGINE
HONEYWELL, INC.
1.0 Introduction and Objective
The first phase of this contract (Tasks A and B) resulted in a highly suc-
cessful demonstration in April 1983 at the MSFC of Honeywell's breadboard
feasibility model of a silicon Piezoresistive Pressure Transducer suitable
for SSME applications.
The purpose of Modification No. 5 of this contract is to expand the scope
of work (Task C) of this research study effort to develop pressure instru-
mentation for the SSME. The objective of this contract (Task C) is to
direct Honeywell's Solid State Electronics Division's (SSED) extensive
experience and expertise in solid state sensor technology to develop proto-
type pressure transducers which are targeted to meet the SSME performance
design goals and to fabricate, test and deliver a total of 10 prototype
units.
SSED's basic Epproach is to effectively utilize the many advantages of
silicon piezoresistive strain sensing technology to achieve the objectives
of advanced state-of-the-art pressure sensors in terms of reliability,
accuracy and ease of manufacture: More specifically, integration of
multiple functions on a single chip is the key attribute of this technology
which will be exploited during this research study.
The objectives of this research study will be accomplished by completing
the following major tasks:
1. Transducer Package Concept and Materials Study
Three transducer design concepts will be generated and analyzed
for the SSME application and materials/processes will be defined
for the research prototype transducer design.
2. Silicon Resistor Characterization at Cryogenic Temperatures
The temperature and stress properties of a matrix of ion
	
oimplanted piezoresistors will be characterized over the tem-
perature range of -320°F to +250°F,,
3. Experimental Chip Mounting Characterization
The mechanical integrity of chip mounting concepts will be eva-
luated over temperature, pressure and vibration.
4. Frequency Response Optimization
	
'I
This task is a paper study which will specify and analyze an
acoustic environment for which transducer frequency response can
be determined and optimized.
GPAGE TWO
5. Prototype Transducer Design, Fabrication, and Test
This major task will use the results generated in Tasks 1
through 4 above to design and develop a research prototype
pressure transducer for the SSME application and will
culminate in the delivery of 10 transducers, 5 each for the
ranges of 0 to 600 psia and 0 to 3500 psia. This task is
subdivided into the following five areas:
- Feasibility Evaluation of Transducer Concept
- Prototype Transducer Design
- Prototype Transducer Fabrication and Test
- Prototype Qualification	 f
- Prototype Delivery.
6. Reports
Honeywell will submit monthly progress reports during the
period of the contract; a final report will be provided at
the completion of the contract.
The format of this report will be to discuss the work
performed for this reporting period and the plans for the
next reporting period for each of the major tasks outlined
above.	 i
t
2.0 Work Performed and Plans
2.1 Transducer Package Concept and Materials Study.
This task was completed per plan during January 1984.
2.2 Silicon Resistor Characterization at Cryogenic Temperatures.
This task was completed in May 1984.
Qt
14
PAGE THREE
2.3 Experimental Chip Mounting Characterization
2.3.1 Work performed in June
- Continued a literature search on the properties of silicon
nitride. The search is broken down into four major categories,
i .e. ,
• General physical-mechanical properties
• Cryogenic behavior
• Fbrming/shaping properties
• Methods of joining silicon nitride to other materials
- The status of this literature search is as follows:
• Ten articles have been received and reviewed.
• These articles contain considerable data on the
physical-mechanical pro perties at room and elevated
temperatures and on the forming/shaping properties of
silicon nitride.
1
• No data has been found on the behavior of silicon
nitride  at cryogenic temperatures. This situation	 i
supports the need to initiate a materials test
program on silicon nitride at cryogenic temperatures,
i.e., consistant with the cryogenic fluids required
for the SSME.
• To-date, these joining methods have been identified,
i.e.,
-- Ti/Cu -- This is an acceptable metallization for
our application. It is reported to be
better than a Cr/Cu metallization. A
500°C post-process anneal is reported to
improve the adhesion of the metal to the
silicon nitride.
-- Ti/Cu/Be -- This metallization is good for the
brazing of silicon nitride-to-silicon
nitride; however, the melting point is
too high for our application.
-- Diffusion and
Glass Bonding -- These are effective joining methods;
however, they too, require higher
temperatures than what our
application can tolerate. 	 t.
PAGE FOUR
- The design work for the following fixtures was completed;
• Vibration testing (4,000g's ).
• High pressure testing.
• High pressure leak, checking.
- These sensor piece-parts were received:
• Silicon nitride subassem'a'lies.	 i
• Lapped and polished pyrex washer.
• Lapped and polished cover-glass window.
e
All the piece-parts have been received so sensor assembly can
be started.
- The assembly of "dummy" sensor chips to the pyrex washer was
started.
2.3.2 Plans for July
The plans are as follows:
- Complete the assembly the Experimental Sensors.
- Complete the fabrication of these fixtures:
• Vibration testing (4,000g's).
• High pressure testing.
• High pressure leak checking.
Start testing sensor asemblies as they are completed.
l
- Continue literature search on silicon nitride with special
emphasis on joining methods.
2.4 Frequency Response Optimization
This task was completed per plan in February 1984.
2.5 Temperature Sensor Network Concept Study.
This task was deleted when the contract was negotiated.
P
-Irk
PAGE FIVE
2.6 Prototype Transducer Design, Fabrication anu Test
2.6.1 Feasibility Evaluation of Transducer Concepts.
2.6.1.1 Define/Finalize Concept for Feasibility Transducer.
This task was completed per plan as reported in May.
The sensor chip design was presented in that report.
Though not mentioned specifically, the sensor package
will be the same as that developed forthe Experimental
Sensor. (Re: previous Monthly Reports.) Clearly, that
design will be modified to reflect insights gained
from the evaluation of the Experimental Sensor.
This task is closed.
2.6.1.2 Feasibility Demonstration of Sensing Concepts.
.1 Work performed in June
- The mask fabrication was completed, and they were placed on
the wafer processing line at our Colorado Springs facility.
- The silicon starting material was characterized for wafer
thickness and staged in the wafer processing line. A
permanent I.D. number was scribed on each wafer to support
correlation of wafer properties and test results,,	 r
- A process spec, run card or traveler were prepared to
support the processing of these wafers.
- Wafer processing was started at our Colorado facility.
- All sensor package piece-parts for the functional Feasibi-
lity Sensor models have been ordered except for the stainless
steel housing and base. The later two items are machined parts
and will be fabricated in our model shop. There is some risk
associated with this approach; however, it is judged to be
low enough to be acceptable. Furthermore, it is required in
order to accommodate the lead times for these parts. These
orders were placed on the basis of the piece-part design and
drawings in-hand at this writing.
.2 Plans for July
The plans are as follows:
- Start the design of special assembly tooling to support the
build of the Feasibility Sensor models.
- Finalize the decision regarding the fabrication of a new
stainless steel housing and base or the modification and
reuse of same from the Experimental Sensor models.
PAGE SIX
2.7 Miscellaneous
Russell Johnson and David Wamstad presented a paper at the "Advanced
High Pressure 02/H2 Technology Conference" held at the Marshall Space
Flight Center on June 27-29, 1984. The paper presented by Honeywell,
Inc. was untitled "An Advanced Solid State Pressure Transducer for
High Reliability SSME Application". A copy of the abstract is
enclosed as Attachment 'C'.
3.0 Schedule -- See Attachment W.
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ATTACHMENT 'C'
AN ADVANCED SOLID STATE PRESSURE TRANSDUCER
FOR HIGH RELIABILITY SSME APPLICATION
R. L. Johnson and D. B. Wamstad
Solid State Electronic Division
Honeywell, Inc.
The objective of this research project is to define and demonArate
new methods to advance the state-of-the-art of pressure sensors for
the Space Shuttle ruin Engine.	 `j	 pr	 j'`j i i" `yThis5 i i^G 1 Ude5 -i m oved r el i 
all	
,
accuracy, cryogenic temperature operation and ease of manufacture.
This paper presents the results of the "Feasibility and Breadboard
Demonstration Phase".and the current status of the "Research
Development Prototype Follow-on Phase." A technology breakthrough
utilizing silicon piezoresistive technology was achieved in the first
phase. Excellent silicon sensor performance, at liquid nitrogen
temperature, was successfully demonstrated at NASA/MSFC.
The follow-on phase is in process. A transducer design concept
for the SSME application utilizes packaging materials with similar
thermal coefficients of expansion and maintains the transducer seal
primarily in compression. The package mechanical integrity will be
tested to the SSME requirements for temperature (-252°C to +120°C,),
pressure (10K psi), and vibration (400 g's). The silicon chip design
will provide dual sensing outputs with integrated compensating
electronics. The silicon resistor ion implant dose was customized for
the SSME temperature requirement. A basic acoustic modeling software
program was developed as a design tool to evaluate the frequency
response characteristics for the package design. Successful
completion of this research project will provide ten prototype SSME
Solid State Pressure Transducers for NASA testing.
The intrinsic attributes of silicon pressure sensor technology,
such as small size, low mass, integratable electronics and reduced
package complexity, all contribute to the attainment of the research
objectives. The advancement in the state-of-the art of solid state
pressure sensing technology, as achieved by this research project,
will provide the technology base of future "Smart Sensors" for space
vehicle applications.


Research pressure instrumentation for NASA Space Shuttle main engine, modification no. 5

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