Method and apparatus for maintaining thermal control in plasma conditions

Abstract

An apparatus and method are disclosed for determining the effects of exposure of oxygen plasma on a thin film polymer whose bulk is maintained at a predetermined temperature. The apparatus includes a chamber having a specimen therein. A plasma environment is provided in the chamber. A closure member is provided for sealing the chamber after the specimen is introduced into the chamber. The closure member also serves as a support for the test apparatus which includes a cooling coil. A platform having the test specimen thereon is supported on the cooling coil to be cooled by coolant flowing through the cooling coils. A thermoelectric module is supported on the platform to assist in maintaining a low test temperature for the test samples. The temperature of the sample is monitored by a thermocouple probe which is in contact with the sample. Any change in bulk sample temperature caused by the thermocouple probe is quickly adjusted to maintain the initial bulk temperature by the thermoelectric module