A novel package, which consists of a carrier housing, has been developed for monolithic-millimeter wave Integrated Circuit amplifiers which operate at 30 giga-Hz. The carrier has coplanar waveguide (CPW) interconnects and provides heat-sinking, tuning, and cascading capabilities. The housing provides electrical isolation, mechanical protection and a feed-thru for biasing

Simons, Rainee N.

Taub, Susan R.

English

NASA Technical Reports Server

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A FLEXIBLE CPW PACKAGE FOR A 30 GHz MMIC AMPLIFIER
Rainee N. Simons and Susan R. Taub
National Aeronautics and Space Administration
Lewis Research Center
Cleveland, OH 44135
SUMMARY
A novel package, which consists of a carrier and housing, has been developed for monolithic-
millimeter wave Integrated Circuit amplifiers which operate at 30 GHz. The carrier has coplanar
waveguide (CPW) interconnects and provides heat-sinking, tuning, and cascading capabilities. The
housing provides electrical isolation, mechanical protection, and a feed-thru for biasing.
1,,.
¢D
INTRODUCTION
MMICs (monolithic-millimeter integrated circuits) are currently available for satellite communica-
tion applications at millimeter wave frequencies (ref. 1). However, very little has been done in the devel-
opment of carriers and housings that enable these circuits to be inserted into actual systems. In this
paper we present the design and characteristics of a CPW (coplanar waveguide) carrier and a housing for
MMIC amplifiers operating at 30 GHz. CPW circuits have the advantage of providing easy series as well
as shunt mounting of microwave devices. Furthermore, since the ground planes are on the same side as
the strip conductor, via holes and wraparounds are eliminated; therefore, parasitics are small. Radiation
loss, when compared to microstrip, is low; hence CPW circuits are less prone to interaction with the
package and EM interference. Another advantage is that CPW circuits lend themselves to fast and in-
expensive characterization using wafer probing equipment.
CARRIER DESIGN
The carrier assembly is shown in figure 1. The carrier consists of a finite width conductor backed
CPW (CBCPW) circuit on a dielectric substrate. The CBCPW circuit consists of a pair of tapered open
circuits which face each other, and are separated by the surrounding ground plane. The ground plane
also serves as an island for mounting MMIC devices and facilitates low inductance ground connections
from any point on the perimeter of the M]VIIC. The length of separation between the open circuits is
chosen to accommodate a particular 1VI_IC chip. By tapering the CPW open circuit the electric field
lines are concentrated at the open end and therefore are coupled efficiently to the short wire bonds
between the CPW input/output lines and the MMIC. A copper post (diameter 0.031 in.) inserted in the
center of the carrier serves as a heat sink for the MM]C. A brass backing plate provides heat dissipation
and mechanical support. The M]VIIC and brass backing plate are attached to the dielectric substrate
using silver conductive epoxy.
This carrier provides advantages in the following areas: Tuning, cascading and calibration. MMIC
tuning is accomplished by sliding small lengths of metal strips over the CPW circuit until the desired
S-parameters are obtained. The metal strips are then glued in place. Two or more of the above carriers
can be cascaded, as shown in figure 1, by use of a novel plastic cllp. The clip slides over and grips the
two brass backing plates. This ensures excellent alignment for wire bonding. LRL calibration can be
performed to the plane of the MMIC.
HOUSING
A singlecarrierwith thehousingis shownin figure2. Thehousingprovidesmechanicalprotection,
electricalisolation,anda coaxialfeed-thrufor biaslines.
EXPERIMENTAL RESULTS
A singlecarrierwastestedby fixing a 50fl GaAsmicrostripline, 700mils long,in placeof an
NIMIC_wire-bondingit to the CPW lines and measuring the S-parameters over the frequency range of
29 to 30 GHz with an HP 8510B Network Analyzer. The measured insertion loss, $21 --- 1.9 dB and the
return loss, $11 < -15 dB, as shown in figure 3. This includes the losses of the Wiltron Universal Test
Fixture and the carrier. These losses were found to be 0.9 dB by measuring the insertion loss of an
identical CPW thru-line on an identical substrate. The insertion loss and return loss measured with and
without the housing is shown in figure 4. The $21 measured, without the microstrip liner is a measure of
the isolation between the input and output ports. The carrier and the housing were tested. An isolation
of greater than 16 dB was measured, which is an improvement of 10 dB over the isolation of the carrier
without the housing. The measured characteristics are shown in figure 5. Figure 6 shows the carrier,
carrier with housing and cascaded carriers.
REFERENCE
1. Saunier, P.; and Tserng, H.Q.: AIGaAs/InGaAs Heterostructures with Doped Channels for Discrete
Devices and Monolithic Amplifiers. IEEE Trans. Electron Devices, vol. 36, Oct. 1989,
pp. 2231-2235.
_I_, f- Lid
MMIC amplifiers -7-- - _ _ _ Bra
o -. * 12
Plastic clip --\ _ __ _:t:s backing
Figure 1 .---Schematic for cascading CBCPW carriers using a Figure 2.--_Schematic of carder with housing. Finite width
plastic clip. conductor backed coplanar waveguide; S1 = 0.013 in.,
W 1 = 0.010 in., S 2 = 0.010 in., W 2 = 0.008 in., D = 0.025 in.,
[r = 10.5, 213 = 0.2 in., H = 0.135 in.
-,10 I I
Frequency, GHz
E
-10
-20
)
-30
29.0
I j
29.5 30.0
Frequency, GHz
(a) Insertion loss.
(b) Return loss.
Figure 3.--Measured characteristics of the carder.
Without housing
-lo I j
Frequency, GHz
0E
_m_ ..... 7--
_1 O
¢ -3o I I
29.0 29.5 30,0
Frequency, GHz
(a) Insertion loss.
(b) Return loss.
Figure 4.mEffect of housing on the measured characteristics of
the carder.
I 0
_ -5
" -lo
-15 I /
n
Frequency, GHz
0 --
I -5 -
-10 --
t-
o -15
_ -20 -
(bl
-25
29.q 29.5
Frequency, GHz
(a) W'rthout housing.
(b) With housing.
Figure 5.--Measured isolation.
30.0
ORIGINAL PAGE
_LACK AND WHITE PHOTOGRAPH
Figure 6._CPW carriers.

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1. AGENCY USE ONLY (Leave blank) 2. REPORT DATE
1992
4. TITLE AND SUBTITLE
A Flexible CPW Package for a 30 GHz MMIC Amplifier
6. AUTHOR(S)
Rainee N. Simons and Susan R. Taub
7. PERFORMING ORGANIZATION NAME(S) AND ADDRESS(ES)
National Aeronautics and Space Administration
Lewis Research Center
Cleveland, Ohio 44135-3191
9. SPONSORING/MONITORING AGENCY NAMES(S) AND ADDRESS(ES)
National Aeronautics and Space Administration
Washington, D.C. 20546-0001
3. REPORT TYPE AND DATES COVERED
Technical Memorandum
5. FUNDING NUMBERS
WU-506-44-2C
8. PERFORMING ORGANIZATION
REPORT NUMBER
E-6973
10. SPONSORING/MONITORING
AGENCY REPORT NUMBER
NASA TM- 105630
11. SUPPLEMENTARY NOTES
Prepared for the Topical Meeting on Electrical Performance of Electronic Packaging cosponsored by the IEEE, MTT, and CHMT,
Tuscon, Arizona. April 22-24, 1992. Rainee N. Simons, Sverdrup Technology, Inc., Lewis Research Center Group, 2001 Aerospace
Parkway, Brook Park, Ohio 44142 (work funded by NASA Contract NAS3-25266); and Susan R. Taub, NASA Lewis Research
Center. Responsible person_ Susan R. Taub_ (216) 433-6571.
12a. DISTRIBUTION/AVAILABILITY STATEMENT 12b. DISTRIBUTION CODE
Unclassified - Unlimited
Subject Category 33
13. ABSTRACT(Maximum 200 words)
A novel package, which consists of a carrier and housing, has been developed for monolithic-millimeter wave
Integrated Circuit amplifiers which operate at 30 GHz. The carrier has coplanar waveguide (CPW) interconnects
and provides heat-sinking, tuning and cascading capabilities. The housing provides electrical isolation, mechanical
protection and a fced-thru for biasing.
14. SUBJECT TERMS
Coplanar waveguide; Package; Amplifier
17. SECURITY CLASSIFICATION
OF REPORT
Unclassified
NSN 7540-01-280-5500
18. SECURITY CLASSIFICATION
OF THIS PAGE
Unclassified
19. SECURITY CLAS S]F;iCA_o_N _
OF ABSTRACT
Unclassified
15. NUMBER OF PAGES
6
16. PRICE CODE
A02
20. LIMITATION OF ABSTRACT
Standard Form 298 (Rev. 2-89)
Prescribed by ANSI Std. Z39-18
298-102


A flexible CPW package for a 30 GHz MMIC amplifier

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