Modelling to predict the reliability of solder joints

Abstract

The work in this thesis investigates modelling methods to predict the reliability of solder joints under thermo-mechanical cycling. A literature review is presented covering analytical methods, creep laws and fatigue laws, and advanced damage mechanics methods. The use of FEA (Finite Element Analysis) to model creep along with a fatigue law to predict lifetime appears to be the most widely used and validated technique at present. The FEA discretisation of elasticity problems is derived using the principle of minimum potential energy and implemented in the code FATMAN (Finite-element Analysis Tool, Multi-physics And Nonlinear). A novel implicit solution scheme called LENI is proposed to allow modelling of creep in solder. The sinh law for steady-state creep and the Armstrong-Frederick kinematic hardening law to capture primary creep have been implemented in FATMAN using the LENI scheme. The advantage over an explicit discretisation is investigated. An inverse analysis method for determining material properties is used to determine constants for the kinematic hardening law from experimental creep curves. A damage law is presented which allows the prediction of crack propagation through a solder joint. A failure criteria based on the increase in electrical resistance is used, which removes the need for an empirical fatigue law. The steady state creep law, the kinematic hardening law and the damage law are all applied to modelling of tests developed at the NPL (National Physical Laboratory) including novel crack detection tests, an isothermal fatigue test, and accelerated thermal cycling of resistors