运用电学法测量功率型lEd冷却瞬态温度曲线,通过数学方法将其转化为积分和微分结构函数来分析器件各区域的热阻和热容,结果发现,各层材料的测量值与理论值基本一致。1μS的瞬态数据采集精度和高的重复性保证了实验结果的准确性和可靠性,运用这种方法比较了3种不同金属芯印刷电路板(MCPCb)对功率型lEd的散热效果,贝格斯Al基板散热性能最好,AnTAl基板次之,普通Al基板最差。研究表明,利用结构函数分析功率型lEd的热特性是一种强有力的方法。The cooling transient temperature curves of high-power LEDs are measured by electritical method.The cumulative and differential structure functions are extracted from these curves to analyse thermal resistances and thermal capacitances of all regimes of high-power LEDs with numeric computational method.It is found out that calculated and measured values of various materials are essentially conformable.The sampling resolution of 1 μs of transient data and high repetition assure the veracity and reliability of experimental result.Subsequently,thermal conduction capabilities of three different metal core printed circuit boards(MCPCBs) with high-power LEDs are compared by this method,and it is discovered that bergquist′s MCPCB has the best thermal conduction capability,ANT′s MCPCB takes second place,and the common MCPCB is the worst.So the structure functions are powerful tools for thermal characteristic analysis of high-power LEDs.国家“863”计划资助项目(2006AA03A175);福建省科技项目(2006H0092;2008J0030);厦门市重大专项资助项目(3502Z20061004
