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Rapid Dertermination of Acrylic Thiourea and Fe ̄(2+) Ion in Copper Immersion Plating Solution

Abstract

根据铂电极上丙烯硫脲对铜电沉积过程的阻化效应和fE2+离子的电化学氧化特性,用dz-1b型电镀添加剂测定仪快速测定浸铜液中丙烯硫脲和fE2+离子浓度。A rapid and simple method For determination of acrylic thiourea and Fe2+ ion content with DZ-1B Electroplating Addtive Analyser is based on the inhibitive eFFect of acrylic thiourea in copper electrodeposit and the electrochemical oxidation property of Fe2+ ion on platnium electrode in copper immersion plating solutio

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