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钾修饰的MoO_3/SiO_2催化剂的XRD和TPR表征
Authors
姚光华
杨意泉
+3 more
王琪
郝影娟
陈爱平
Publication date
10 May 2007
Publisher
Abstract
采用XRD和TPR测试技术表征了一系列不同K与Mo摩尔比的MoO3/K2O/SiO2催化剂。XRD表征结果显示,随着元素K的加入,多钼物种逐渐被破坏,最终形成了单钼的K2MoO4物种。TPR表征显示,催化剂表面的钼物种有2种结构,即八面体的Mo(Oh)和四面体的Mo(Td)。八面体Mo(Oh)的还原峰在770 K附近,而四面体Mo(Td)还原峰在1 000 K附近;无K的MoO3/SiO2催化剂的低温还原峰出现在840 K,少量元素K的添加削弱了Mo与SiO2之间的作用,使得低温还原峰温度降低到770 K附近;随着元素K添加量的进一步增加,Mo(Oh)物种逐渐减少而Mo(Td)物种逐渐增多,从而使得催化剂表面的Mo更难被还原。高硫合成气制甲硫醇的活性随着钼基催化剂八面体(Oh)钼物种的增加而增加
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Last time updated on 16/06/2016