Corresponding author. Email: [email protected]; Tel: +86-592-2185957; Fax: +86-592-2181436.[中文文摘]研究并讨论了在新型柠檬酸盐体系铜电沉积工艺中电镀工艺参数对镀层形貌和颗粒尺寸的影响;利用X射线衍射(XRD)和X射线光电子能谱(XPS)表征了镀层的结构和组分存在状态;并将柠檬酸盐体系电沉积铜应用于微机电系统(MEMS)加工工艺.结果表明:在6 g.L-1 Cu2+,pH=7.0-8.5,1-2 A.dm-2,45℃,搅拌条件下可得到结晶细小,表面平整的致密铜镀层;镀层为面心立方多晶结构的单质铜,不含其他杂质.利用MEMS工艺成功制得平面电感,其有效的最大品质因数(Q)为12.75,达到了设计要求.[英文文摘]We investigated the effect of plating parameters on the coating morphology and grain size of copper using a novel citrate bath.The structure and deposit were characterized by X-ray diffraction(XRD) and X-ray photoelectron spectroscopy(XPS),respectively.The copper plating bath was applied to a micro-electro-mechanical system(MEMS).Results show that an even and compact copper coating was obtained for the fine grains using plating parameters of 6 g.L-1 Cu2+,pH=7.0-8.5,1-2 A.dm-2,45 ℃,and bath agitation.The deposit consists of pure copper in
a fcc polycrystalline structure. A planar inductor was successfully fabricated by MEMS using this bath and its maximum quality factor was 12.75, which satisfies the design requirements.国家自然科学基金(20873114,20833005); 国家重点基础研究发展规划项目(973)(2009CB930703)资
