Montageverfahren mit flexiblen Schaltungstraegern fuer Mikrosysteme Verbundprojekt 1991-1994. Abschlussbericht

Abstract

Basic research and development work was carried out on assembly technologies of multi chip modules with flexible polymer substrates. As interconnecting technique the tape automated bonding (tap) was chosen, but also the chip-on-board and the flip-chip technique have been applied. In addition the chip-in-board technique - the assembly of a chip into a multilayer pc board or the combination of flexible boards with thick layerhybrids - has been used. As reference of the achieved technological progress demonstrators are presented for different purposes. (WEN)SIGLEAvailable from TIB Hannover: RR 3532(27) / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman