Integrierte Komponenten fuer optisches Abtastsystem auf Silizium-Basis Abschlussbericht

Abstract

Optical memory and optical data storage will play a leading role in future multimedia applications. One component of the optical disk system is the optical pick-up. The aim of this project was the development of the basic technology for the fabrication of a new ultralight optical pick-up system based on integrated components on silicon. Using both microelectronic and optoelectronic components, the projected pick-up should meet the criteria of the industrial mass production. In order to guarantee an easily adjustable outcoupling of the laser light, our alternative pick-up concept uses micromechanically etched silicon facettes. A complete process technology for anisotropic wet etching of silicon facettes was developed. The design of the silicon motherboard was proposed. A set of different photomasks was fabricated. Within the project, the lithography and the pattern-transfer part were optimized down to lateral dimensions of 25 nm using modified multilayer-resist systems. The developed technology will be used for the fabrication of optical grids and holograms. Additionally, molds for imprinting of nanostructures can be performed by the developed techniques. For characterization of optical components a home made measurement technique was builted-up. According to the BMBF order dated from 0.1.04.1997 this research project was stopped, because the cooperation agreement of the industrial partner company was withdrawn. Until May 31, 1997 no legally binding request of another cooperating company was submitted to the BMBF. (orig.)SIGLEAvailable from TIB Hannover: F98B420+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman