Lasergestuetztes Sensorsystem zur Online-Prozesskontrolle fuer das US-Bonden von Mikrosystemen (LASOP-MST) Abschlussbericht

Abstract

The project served the further development of standard deformation control during ultrasonic wirebonding. The innovative aspect of the project is the implementation of laser-optical vibration measurement in the first phase of interconnection (cleaning phase). In this context it was proven that an interferometric measurement system can be successfully applied for the online recording of vibration amplitude at automatic bonding systems (rotating head). Simultaneously, a functional dependence between interconnection quality and vibration kinetics was observed. These relations were transferred into a new online quality control system, leading to an increase in process stability and bond quality. (orig.)Available from TIB Hannover: F00B1304+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekSIGLEBundesministerium fuer Bildung und Forschung (BMBF), Bonn (Germany)DEGerman