Interfaces play an important role in crystalline plasticity as they affect strength and often serve as obstacles to dislocation motion. Here we investigate effects of grain and nanotwin boundaries on uniaxial strength of 500 nm diameter Cu nanopillars fabricated by e-beam lithography and electroplating. Uniaxial compression experiments reveal that strength is lowered by introducing grain boundaries and significantly rises when twin boundaries are present. Weakening is likely due to the activation of grain-boundary-mediated processes, while impeding dislocation glide can be responsible for strengthening by twin boundaries
