Metal-metal composites were first produced in a copper matrix in the 1970’s, and they have since been produced in several other binary metal systems. This strengthening technique reinforces a ductile metal matrix with a ductile metal second phase. In some binary systems, this technique confers extraordinarily high strength and hardness while still maintaining low electrical resistivity. This article reports on the first gold matrix metal-metal composite, which was produced by deformation processing a 90%Au-10%Ag powder compact. The Au-Ag specimen studied had an ultimate tensile strength of 550 MPa and an electrical resistivity only 8% higher than that of pure Au at a deformation processing true strain of 5.6. The 590 nm average Ag filament thickness in this composite was relatively coarse compared to other deformation processed composites, which suggests that substantially higher strengths would be possible in a gold matrix metal-metal composite using deformation processing to higher true strains to reduce the filament thickness

Chumbley, L. Scott

Harringa, Joel L.

Parks, James

Russell, Alan M.

Xu, Kai

English

Metal-metal composites were first produced in a copper matrix in the 1970’s, and they have since been produced in several other binary metal systems. This strengthening technique reinforces a ductile metal matrix with a ductile metal second phase. In some binary systems, this technique confers extraordinarily high strength and hardness while still maintaining low electrical resistivity. This article reports on the first gold matrix metal-metal composite, which was produced by deformation processing a 90%Au-10%Ag powder compact. The Au-Ag specimen studied had an ultimate tensile strength of 550 MPa and an electrical resistivity only 8% higher than that of pure Au at a deformation processing true strain of 5.6. The 590 nm average Ag filament thickness in this composite was relatively coarse compared to other deformation processed composites, which suggests that substantially higher strengths would be possible in a gold matrix metal-metal composite using deformation processing to higher true strains to reduce the filament thickness.This article is from Gold Bulletin 31 (1998): 88–92, doi:10.1007/BF03214768.</p

Russell, Alan

Chumbley, L.

Harringa, Joel

Digital Repository @ Iowa State University (ISU)

A New Method for Strengthening GoldAlan Russell, Kai Xu, Scott Chumbley, James Parks andJoel HarringaAmes Laboratory ofIowa State University, Ames, IA 50011, USAMetal-metal composites were first produced in a copper matrix in the 1970's, and they have since beenproduced in several other binary metal systems. This strengthening technique reinforces a ductile metalmatrix with a ductile metal second phase. In some binary systems, this technique confers extraordinarilyhigh strength and hardness while still maintaining low electrical resistivity. This article reports on the firstgold matrix metal-metal composite, which was produced by deformation processing a 90%Au-l0%Agpowder compact. The Au-Ag specimen studied had an ultimate tensile strength of 550 MPa and an electricalresistivity only 8% higher than that of pure Au at a deformation processing true strain of 5.6. The 590 nmaverage Ag filament thickness in this composite was relatively coarse compared to other deformationprocessed composites, which suggests that substantially higher strengths would be possible in a gold matrixmetal-metal composite using deformation processing to higher true strains to reduce the filament thickness.DEFORMATION PROCESSEDMETAL-METAL COMPOSITESDuring the past two decades, a new class of copper-refractory metal composites has been developed withextraordinary mechanical and electrical properties (1-3). These composites, composed of face-centered cubicCu with 10 to 30% by volume element X (where X is abody-centered cubic metal immiscible in Cu, such asNb, V, Ta, Cr, or Fe), are severely deformed byextrusion/swaging/wire drawing or by rolling toproduce the nanometer-scale microstructure of Xfilaments in a Cu matrix shown in Figure 1. The Cu-20%Nb system is the most thoroughly studied of thesecomposites. These materials are best known for theirextraordinary tensile strengths, which can be as high as2400 MPa after deformation to a true strain (T) ) of 12(4). However, they possess other unusual properties aswell, including:strength-to-electrical-resistivity ratios much higherthan those of any copper alloythe smallest filamentary microstructures (phasesize) of any material available in bulk quantitiesphase structures with very low dislocationdensities, approaching whisker quality in manycasesThe Cu-X deformation-processed metal metal£omposites (DMMC's) are characterized byremarkableductility, which allows cast- or powder-processed88starting billets to be deformed as much as T) = 13.4 (5).Such deformations represent more than an 800-foldreduction in diameter and are accompanied by aconcomitant reduction in the thickness and spacing ofthe X phase. Thus, an as-cast billet of Cu-20Nb,displaying Nb dendrites with an average thickness ofFigure 1 TEMmicrograph ofa Cu-20Nb DMMC at a truestrain of9 sectioned transverselyandphotographed inconical scan dynamic dark f1eld conditions to show theNb f1laments as the lightgrey phase and the Cumatrix as the dark greyphase. Note that the Nbf1laments are typically 10 to 25 nm thick; theiroriginal thickness in the cast starting ingot fll = 0)was 5 to 121J.m.tJii9' Cold Bulletin 1998, 31 (3)Figure 2 Combined SEMphotographs oftransverseandlongitudinal section views ofa Cu-20%Nb DMMCfrJ =3.6) arranged to depict its microstructuralphaseshape in relation to the wire specimens overalldimensions. Note the convolutedribbon shape ofthebee Nb f1laments caused by the plane strain ofthe bee[110j tiber axis deformation texture. Fcc f1lamentswould remain approximately cylindrical in shape.5/-1m, may be deformation processed at roomtemperature into a wire with Nb filaments averaging7 nm thick (6). These in situ processed composites havestrengths substantially greater than the strengths of anyother Cu alloys. Debate continues on themechanismls) that account for the high strengths ofthe Cu-X composites (7-11), but discussion centersaround the role of the nanofilamentary X structure inimpeding propagation and motion of dislocations inboth the Cu and X phases.In an effort to extend these desirable deformationprocessing attributes to non-copper systems, theauthors have produced several DMMC's withhexagonal close-packed (Tt, Y, Sc, and Mg), body-centered cubic (Nb, Fe, V, Mo, [3-Ti). and face-centered cubic (AI, Au, and Ni) metals. This workbegan in 1990, and continues today (12-14). Twomajor conclusions can be drawn from theseexperiments:1. A large number of ductile metals can producenano-scale DMMC's, and2. Hexagonal close-packed (hcp) and body-centeredcubic (bee) metals develop textures duringaxisymmetric deformation processing that causeplane strain in the developing filaments, formingconvoluted ribbon-shaped filaments (see Figures(€ii;}' Cold Bulletin 1998,31 (3)1-2). In contrast, face-centered cubic (fcc) metalswith their larger number of slip systems do notdeform in plane strain and are capable of formingfilaments that are more nearly cylindrical in shape.GOLD MATRIX DEFORMATIONPROCESSED METAL-METALCOMPOSITES (DMMC'S)The fcc structure of gold and the numerousapplications for gold requiring hardness, highstrength, and high electrical conductivity suggestthat gold would be an excellent candidate matrix fora DMMC. However, equilibrium gold binarysystems with other ductile metals are not ideallysuited for DMMC formation, since few gold binarysystems possess the desired criteria of low mutualsolid solubility and the absence of intermetalliccompounds. Two systems that do meet these criteriaare Au-Rh and Au-Mo, and the authors firstattempted to make a gold DMMC with melt-processed Au-Rh and Au-Mo specimens. However, inboth systems the flow stress of the second phasemetal is much higher than that of the gold matrix,and the second phase metals failed to plasticallydeform.In binary systems where equilibrium phasediagrams are poorly suited to melt processing, analternate method to prepare a DMMC is powderprocessing of the two metal powders. In such powderprocessed DMMC's, a microstructure consisting of thetwo elemental phases can be preserved by performingall processing steps at temperatures low enough toprevent formation of equilibrium microstructures.P/M may prove to be the only feasible means ofproducing Au matrix DMMC's, and this method wasused to produce the Au-Ag DMMC described in theremainder of this paper.Experimental ProcedureAu powder of 99.95% metals basis purity and 1.6 to6.8 urn particle size was mixed with Ag powder(99.9% metals basis purity) of 4 to 7 u.m particlesize. These powders were blended and coldisostatically pressed at 138 MPa to form a 29.4-gramgreen compact of 90vol%Au and 10vol%Ag. The11.1 mm diameter CIP'ed compact was sealed into aCu can prior to deformation processing. The truestrain of the specimen was calculated using thefollowing equation:89do where, T) = true strain, do =originalT)=21n -d[ diameter, and d[=final diameterThis assembly was swaged at 295 K to a true strain ofT)=3.7 (with appropriate adjustment for collapse of the30% porosity of the CIP'ed compact), at which pointthe Cu was removed by etching in nitric acid, leaving a1.45mm diameter Au-lOAg composite wire. The barespecimen was then wire drawn to a final diameter of0.57mm (T)=5.6). Metallography specimens wereprepared from the material at T)=3.7 and at T)= 5.6.Metallographic specimens were examined in an Amray1845FE field emission SEM.Gauge lengths for the five tensile specimens of theT)=5.6 material were reduced 10% in diameter bymicro-grinding on a lathe. Tensile specimens were heldin miniature pin vice grips and pulled at 295 K at astrain rate of 0.0042mm/s. Ductility was determinedby measuring the fracture surface diameter of eachtensile specimen in a traveling optical microscope andcomparing that value with the initial diameter of thetensile specimen.Electrical resistivity measurements were performedusing the four-point resistance method at 295 K onT)=5.6 Au-lOAg DMMC in the as-drawn conditionand after annealing in air at 673 K for 600s, 2000s,and 10 OOOs.Results and DiscussionThe deformation processing produced a microstructureof Ag filaments, roughly cylindrical in shape, in an Aumatrix, as shown in Figures 3 and 4. The classic'convoluted ribbon shape' of the Nb second phasefilaments seen in Figures 1 and 2 is not seen in this Au-Ag DMMC. The fcc structure of the Ag second phasehas multiple slip systems, and the plane straining modeseen in bee Nb is absent in fcc Ag. For this reason, theAg filaments change during deformation processingfrom equi-axed powder particles to filaments that areapproximately cylindrical in shape. This behavior hasbeen observed previously in fcc-fcc DMMC's, such asthe eutectic Ag-Cu DMMC of Frommeyer andWassermann (15) and the Cu-24 wt.% Ag DMMC ofSakai and Schneider-Muntau (16).The ultimate tensile strength of the Au-lOAgT)=5.6 wire was 550 MPa (standard deviation = 34MPa), and the ductility measured as reduction in areaof the fracture surface was 16% (standard deviation8.2%). The Vickers microhardness of the Au-lOAgwire was 95.3 VHN (standard deviation = 2.2 VHN)at T) = 3.7 and 131.2 VHN (standard deviation = 7.2VHN) at T) = 5.6. In most DMMC's, the strength and90Figure 3 SEMmicrograph ofa longitudinal section of the Au-Ag composite wire (YJ=3.7). The darker bands aresilver filaments in the (lighter) gold matrix in thisback-scattered electron image. The indentation in thesurface results from a Vickersmicrohardness test.Figure 4 Micrograph ofa transversesection of the Au-Agcomposite wire (YJ=56). The darker regions are silverfilaments in the (lighter) gold matrix in this back-scattered electron image.hardness increase as the mean true spacing betweenfilaments decreases. Using the stereology methods ofUnderwood (17), mean center-to-center spacingbetween the Ag filaments was measured fromtransverse section micrographs using the relation:1CJ= -NLwhere N L = number of particles intercepted per unitlength of circular test line and CJ = mean center-to-center spacing. Mean free path (A.) between the(fjS- Cold Bulletin 1998, 31(3)Figure 5 Electrical resistivity versusannealing time in air at673 K for Y]=56 Au-lOAgDMMC. The lowerhorizontal line indicates the electrical resistivity oftheas-drawn wire with no annealing. The upperhorizontal line indicates the electrical resistivity ofaAu-Ag solid solution of this composition (18).8.8% higher than the resistivity of pure gold (2.35mOhm-cm) (19). Since the composite consists of puresilver filaments in a pure gold matrix with thefilaments oriented parallel to the wire axis, the secondphase presents a relatively small scattering cross sectionto current. By comparison, an annealed gold-silversolid solution of this composition was found by otherinvestigators (18) to have a resistivity of 5.13 mOhm-ern and strength of 150 MPa.The microstructure of the Au-lOAg DMMC ismetastable. Given sufficient time at elevatedtemperature, the DMMC will diffuse to form theequilibrium solid solution microstructure. In an effortto characterize this process, pieces of the T)=5.6 Au-lOAg DMMC were annealed in air at 673 K forvarious time intervals, and the electrical resistivity ofthese specimens was compared to the resistivities ofunannealed T)=5.6 Au-lOAg DMMC and a solido100filaments (sometimes called the mean edge-to-edgespacing) is given by the relation:A= I-PpNLwhere Pp is the volume fraction of Ag filaments. Theaverage filament thickness (t) of the Ag fibres wasmeasured from transverse section micrographs usingthe following equation:(l-pJt = ----:,-:--NLwhere PM is the volume fraction of the matrix. In thisAu-lOAg DMMC, the values for phase size andspacing are shown in Table 1.The 590 nm Ag filament thickness in the T)=5.6Au-lOAg DMMC is much larger than the 10 to 20 nmfilament thicknesses typically seen in DMMC's thathave been deformed to higher true strains (1-4, 15),suggesting that the strength and hardness of this T)=5.6Au-lOAg DMMC are probably well below themaximum values attainable in an Au-Ag DMMC. Ofthe DMMC's previously studied, the system mostsimilar to the Au-lOAg DMMC is the eutectic Ag-CuDMMC of Frommeyer and Wassermann, which hadultimate tensile strength of 1450 MPa at T)=9.2. Theconsiderable ductility of the T)=5.6 Au-lOAg DMMCalso suggests that further deformation processingwould be possible. The ultimate tensile strength of theAu-Ag DMMC is about four times greater than thestrength of pure annealed gold (18). Themicrostructures of the Au-Ag DMMC of this studyand the Ag-Cu DMMC of Frommeyer andWassermann (15) are essentially identical in shape;however, the Ag-Cu DMMC was deformationprocessed to a higher true strain (T) = 9.2) and hasmuch smaller filament thickness and spacing.The electrical resistivity of the T)=5.6 Au-lOAgDMMC was 2.556 mOhm-cm at 295 K, which is6U 5§6 4e.>:3..§.~~2'"n::.....1000 104Ann ealin g T ime (sec)105Mean center-ta-center Mean free path between Average filam e ntspacing between Ag particles (A) in u.m thickness (t) in u rnfilaments (<J') in u rnNA* NA' 4 to 1"8.1 7.3 0.816.0 5.3 0.59a3.75.6Table 1 Phase size and spacing for Au-lOAgDMMC deformed to Y] =3. 7 and Y] =5 6True Strain (1))* NA, not applicable; the specimen was not fully dense in the as-Clf'd condition.** Supplier's indicated Ag particle size. Some agglomeration of Ag particles may have occurred in powder processing of the Ag used inthis study.(€ii;}' Cold Bulletin 1998,31 (3) 91solution of this same composition, as shown in Figure5. Even a 10 minute anneal at 673 K increasesresistivity by more than 50%, presumably due to inter-diffusion of the two metals. This behavior is consistentwith Fick's Law diffusion calculations; the diffusioncoefficients for interdiffusion of Au and Ag arerelatively high. Producing a gold DMMC withsuperior high temperature stability would require useof a second phase metal with a diffusion coefficient inAu smaller than in Ag. Several ductile metals suitablefor deformation processing have diffusion coefficientsin Au that are one to two orders of magnitude smallerthan in Ag.Potential for Further DevelopmentThe significance of this initial attempt at gold matrixDMMC production lies not so much with theproperties of the T)=5.6 Au-lOAg DMMC per se as inthe potential it heralds for substantially greater propertyimprovements by refinements in the processing.Although the ultimate tensile strength of 550 MPa atT)=5.6 for the Au-lOAg DMMC is much higher thanthe strength of pure annealed gold, it is lower than theultimate tensile strength of several precipitation-hardened gold alloys (egAu-1 wt%Ti with (JUTS = 1000MPa) (20). It remains for future studies to determinewhether deformation beyond T)=5.6 would furtherstrengthen an Au-lOAg DMMC and whether the 10%Ag volume is optimal. The authors are preparing todeformation process several larger Au-Ag specimens tohigher T) values and to measure their ductility,weldability, and electrical resistivity to explore thesepotential approaches to achieve higher strength.Additional studies of Au matrix DMMC's with a secondphase metal other than Ag are also underway, and theauthors hope to present these results in a second GoldBulletin article when these studies are completed.ACKNOWLEDGEMENTSThis research was supported by NASA's Iowa SpaceGrant Consortium and by Kulicke & Soffa Industries,Inc., Willow Grove, PA. The authors acknowledge theirvaluable discussions with T Ellis of Kulicke & Soffa92Industries and the work of L Jones, L Lincoln, PWheelock, and E Zoellner of the Ames LaboratoryMaterials Preparation Center for preparing andanalyzing the materials used in this study. This work wasperformed at Ames Laboratory, operated for the USDepartment of Energy by Iowa State University undercontract no. W-7405-ENG-82.REFERENCESJ Bevk, JP Harbison and JL Ben, J Appl. Phys., 1978,49 (12), 6031 6038JD Verhoeven, FA Schmidt, E.D. Gibson and WA Spitzig, J Metals, 1986, 38 (9),20 24.3 JD. Verhoeven, A Spitzig, LL Jones, HL Downing, CL Trybus, E.D. Gibson,LS. Chumbley, LG. Fritzmeier and G.D. Schnittgrund, J Mat Eng, 1990, 12 (2),127 ·139WA Spitzig. and PD. Krotz, Acta Metallurgica, 1988,36 (7), 1709 ·1715JD. Verhoeven, WA Spitzig, FA Schmidt and CL Trybus, Mat Manu! Processes,1989,4 (2), 197·209JD. Verhoeven, WA Spitzig, FA Schmidt, PD. Krotz and E.D. Gibson, J Mat Sci.1989,24,101510207 PD. Funkenbusch and TH Courtney, Acta Metallurgica, 1985, 33(5).913·9228 LS. ChumbleyH. Downing, WA Spitzig and JD. Verhoeven, Mat Sci. Eng, 1989,A117,59 65.9 CL Trybus, LS. Chumbley, WA Spitzig and JD. Verhoeven, Ultramicroscopy, 1989,30,315·32010 PD. Funkenbusch and TH Courtney, Scripta Metallurgica, 1989, 23, 1719·172411 WA Spitzig, JD. Verhoeven, CL Trybus and LS. Chumbley, Scripta MetallurgicaetMateriaha, 1990, 24, 1171·117412 JA Jensen, AM. Russen, TW Eilis and LS. Chumbiey, in i\iuminum andMagnesium for Automotive Applications'. ed. JD. Bryant and DR White,TMS Pubiications, 420 Commonweaith Dr., Warrendaie, PA, 199513 JD. Verhoeven, TW Eiiis, AM. Russen and LL Jones, us Patent 5,200,004,199314 AM. Russen, LS. Chumbiey, TW Eilis, FC Laabs, B. Norris and G.E. Donizetti,J Mat Sci, 1995, 30, 4249·426215 G.Frommeyer and G. Wassermann, Acta Metallurgica, 1975, 23, 1353·136016 Y Sakai and H,J Schneider·Muntau, Acta Materialia, 1997,45,1017·1023.17 E.E. Underwood, 'Quantitative Stereoiogy', Addison·Wesiey, Reading, MA, USA1970, pp. 80·9318 E.M. Wise, 'Goid: Recovery, Properties, and Applications'. D. Van Nostrand Co.,Princeton, NJ USA (1964) 88·10419 HE Boyer and TL Gan, i\SM Metais Handbook', American Society for Materiais,Materiais Park, OH, USA, 1985, 14520 G.Humpston and DM. Jacobson, ColdBull 1992, 25, 132·145(fjS- Cold Bulletin 1998, 31(3)

A new method for strengthening gold

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A new method for strengthening gold

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