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research
Recent Advances in High-k Nanocomposite Materials for Embedded Capacitor Applications
Authors
Jiongxin Lu
C. P. Wong
Publication date
1 October 2008
Publisher
Institute of Electrical and Electronics Engineers, Inc., New York
Doi
Cite
Abstract
©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.DOI: 10.1109/TDEI.2008.4656240In this paper, a wide variety of high dielectric constant (k) composite materials which have been developed and evaluated for embedded capacitor application are reviewed. Current research efforts toward achieving high dielectric performance including highk and low dielectric loss for polymer composites are presented. New insights into the effect of unique properties of the nanoparticle filler, filler modification and the dispersion between filler and polymer matrix on the dielectric properties of the nanocomposites are discussed in details
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Last time updated on 21/06/2012