research

Examination of improvement effect of surface modification of Cu with organic acid on solder paste wettability using a laser displacement meter

Authors
Publication date
1 December 2010
Publisher
大阪大学接合科学研究所

Abstract

Abstract is not available.

    Similar works

    Full text

    thumbnail-image

    Available Versions

    Osaka University Knowledge Archive

    redirect
    oaioai:ir.library.osaka-u.ac.jp:1...
    Last time updated on 02/06/2016