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Dehnungsanalyse an ultradünnen Siliziumchips nach dem Umschmelzen von Gold/Zinn-Bumps
Authors
Kaspar Hungar
Wilfried Mokwa
Uwe Schnakenberg
Publication date
1 January 2007
Publisher
VDE Verl.
Abstract
Abstract is not available.
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Publikationsserver der RWTH Aachen University
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Last time updated on 25/05/2016
