Bar-Cohen, Avram

Bar-Cohen, A.

DSpace@MIT

Thermal Management of Electronics– Energy Conversion IssuesAvram Bar-CohenDepartment of Mechanical EngineeringUniversity of MarylandRohsenow Symposium – MIT Cambridge, Mass May 16th 20035/16/03 WMR-ABC 2Drivers for Thermal Packaging Air as the Ultimate Heat Sink Market-Driven Thermal SolutionsPrice – volume – weight – reliability  Environmentally-Friendly Design¾Low power consumption¾Semiconductor devices¾Packaging and cooling¾Low noise: acoustic and EMI ¾Recyclability Feature-Rich Design Tools¾ Integrated with product CAD system¾Parametric optimization5/16/03 WMR-ABC 3 “spreading” + natural convection/radiation  Entropy generation minimization  Least-material optimization Least-energy optimizationWork allocation factor, ξpp=  Pumping work/Total cooling work=  Wpp / [WM + WPP]Design for Sustainability5/16/03 WMR-ABC 4Design for Sustainability Metrics Coefficient of PerformanceCOP  =  qT/IPIP  =  Vair × ∆P Total Work Coefficient of PerformanceCOPT =  qTt1/WTWT =  WM + WPPWM =  85 M   (aluminum-estimated) 5/16/03 WMR-ABC 5High Performance Heat Sink Arrays(d) Forging (e) Skiving(a) Bonding (b) Folding(f) Machining(c )Modified Die-Casting5/16/03 WMR-ABC 6Heat Sink Coefficient of PerformanceL = W = 0.1 m, H = 0.05 m, θb= 25 K, k = 200 W/m-K∆P = 40Pa, Vair = 0.02 m3/sqT = 284W, IP = 0.8WCOP = 355∆P = 40Pa, Vair = 0.02 m3/sqT = 194W, IP = 0.8WCOP = 243203040506070800.010.0150.020.0250.030.0350.0401002003004005006007008009001000Qmax/WppVair (m3/s)∆P (Pa)900-1000800-900700-800600-700500-600400-500300-400200-300100-2000-10020 30 40 506070800.010.0150.020.0250.030.0350.0401002003004005006007008009001000Qmax/WppVair (m3/s)∆P (Pa)900-1000800-900700-800600-700500-600400-500300-400200-300100-2000-100(a) (b)Maximum heat transfer design Least material designCOP = qT/ IPCOP = qT/ IP5/16/03 WMR-ABC 7COPT Comparison Forced convection SISE plate-finsL= W = 0.1 m, H = 0.05 m, θb= 25 K, k = 200 W/m-KCOPT = qTt1/WT20 3040506070800.010.0150.020.0250.030.0350.040102030405060708090100Q/ET∆P (Pa) Vair (m3/s)90-10080-9070-8060-7050-6040-5030-4020-3010-200-1020 30 4050 6070800.010.0150.020.0250.030.0350.040102030405060708090100Q/ET∆P (Pa) Vair (m3/s)90-10080-9070-8060-7050-6040-5030-4020-3010-200-10(a) (b)Maximum heat transfer designLeast material designWT = 85M + IP t15/16/03 WMR-ABC 8203040506070800.010.0150.020.0250.030.0350.040102030405060COPT Vair, m3/s∆P, Pa203040506070800.010.0150.020.0250.030.0350.040102030405060COPT∆P, PaVair, m3/s(a) COPT, Extrusion (b) COPT, SkivingCOPT ComparisonForced convection SISE plate-finsL= W = 0.1 m, H = 0.05 m, θb= 25 K, k = 200 W/m-KCOPT = qTt1 /WT WT = 85M + IP t15/16/03 WMR-ABC 9COPT Optimization SISE plate-fins, WT = 10 kWh, t1 = 6000hW T  = 1 0  k W h , t1 =  6 0 0 0  hNC: natura l c onvec t ion,  F C : forc ed c onvec t ion01020304050607080901000 1 2 3 4 5 6 7 8 9 10 11F in  D en s ity , N /c mCOPT  = [ (q t1) / WT ]F C, 0.028 F C, 0.042F C, 0.083 F C, 0.125F C, 0.139 F C, 0 m as sNC, a ll m as sW ork  a lloc at ion fac tor,  ξpp =  W pp /  W TL ocus o f C O P T , m ax5/16/03 WMR-ABC 10Refrigeration Technologies for Microelectronics Kryotech IBM S/390 G4P P P P P PN N N N N NSubstrateCapThermoelectricChipmoduleEpoxyinterfacesThermalpaste5/16/03 WMR-ABC 11Issues in Refrigerated Packaging CMOS Chip/CPU Performance Performance Driven by” Hot Spots”  “Cost” of Refrigeration System¾Life Cycle Cost¾Volume, Mass¾Power Consumption Reliability of Refrigeration/Packaging ¾Refrigeration Hardware¾Condensation on PCBs + Refrigerant Lines¾Vibration 5/16/03 WMR-ABC 12FundamentalThermal Packaging Research Low-cost, high-k packaging materials  Low-cost, reliable PCM’s  Enhancement of convection/boiling/spray  Heat Sink/HX Manufacturing processes  Compact liquid cooling/refrigeration systems Improved solid state refrigeration Low environmental impact systems  Integrated modeling tools 5/16/03 WMR-ABC 13Concluding Thoughts Growing energy consumption in electronic systems  Thermal Management significant fraction of energy consumption Promise of local energy conversion Design for sustainability requires: Passive cooling where feasible  Optimization of COP for active cooling Optimization of COPT for all systems 

Thermal management of electronics: Energy conversion issues

http://dspace.mit.edu/bitstream/1721.1/7298/1/BARCOHEN_final.pdf

Thermal management of electronics: Energy conversion issues

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