Ruthenium is the least expensive of the platinum group metals, and is an attractive altemative to both rhodium and gold in contact finish applications, as in electronics. Ruthenium in sealed-reed contacts to resist contact sticking, is a noteworthy application. However much ruthenium can be applied for a particular purpose, the availability of satisfactory electroplating processes demands an extensive investigation for the establishment of the same. Hence there is a need to get a standard basic electrolyte which can help getting a good uniform and smooth deposit of ruthenium ontinuously, witbout any deterioration of the electrolyte. Till today there has heen no citation in literatUl-e regarding the same. l11e present paper focuses on the method of preparation of ruthenium platin~ concentrate, it.. st.'lbility with time, and some of its performance characteristics

Krishnan, R.M.

Sekar, R.

Sobha , J.

Sriveeraraghavan, S.

Visalakshi, R.

IR@CECRI

Bulletin ofElectrochemistry 15 (7-8) luly-August 1999, pp 238-241 0256-1654/99/$ 3-50 © 19QQ CECRI A SIMPLE METHOD FOR THE PREPARATION OF RUTHENIUM PLATING SOLUTION VISALAKSHI RAVlNDRAN, S SREEVEERARAGHAVAN, R SEKAR, SarmA JAYAKRISIINAN AND RM KRISHNAN Central Electroche.mical Researcb Institute, Karaikudi 630 006. INDIA Ruthenium is the least expensive of the platinum group metals, and is an attractive altemative to both rhodium and gold in contact finish applications, as in electronics. Ruthenium in sealed-reed contacts to resist contact sticking, is a noteworthy application. However much ruthenium can be applied for a particular purpose, the availability of satisfactory electroplating processes demands an extensive investigation for the establishment of the same. Hence there is a need to get a standard basic electrolyte which can help getting a good uniform and smooth deposit of ruthenium ontinuously, witbout any deterioration of the electrolyte. Till today there has heen no citation in literatUl-e regarding the same. l11e present paper focuses on the method of preparation of ruthenium platin~ concentrate, it.. st.'lbility with time, and some of its performance characteristics. Keywords: Ruthen lum, eleclrodeposition, concen Irate. EXPEJUMENTAL INTRODUCTION Standard information available from literature indicated the onvcnienl starting material for preparation of the plating Ruthenium is comme-rcially reported to be used to harden complex tn he Ruthenium l'hloride in HCI at a concentration alloys of palladium and platinum III. The alloys are uSl~d as kvcl 350-400 g of RuUH'niulll per litrc. Based upon the elrctrical contacts (12% RuthcniulU in platinum) and in report [4), various means of preparing ruthenium sulphamate jeweJkry, and in fountain pcn tips. It is also used for Concentrate have be n exphm'd. Among tbe various methods industrial c<ltalysis (hydroge-nation of alke.nes and kdones) studied, tbe tn'atmcnt of tbe Ruthenium chloride salt and for automobile emission control. In the last dl~cadc of (RuCl~. 3HP), hydrochloric acid and sulphamic acid in the this ccntury, following tbe development of Ruthenium as an appropriate manner only (as givcn under) proved to be tbe­alternative dcposit to cheaper rhod ium in dectrkal contact worthy meUlOd of preparing qu ite: a stable ruthenium plating applications, preparation of ruthenium plating concentrates emuplcx. based upon nitrosyl sulphamate was reported in (21. From Method of preparation of the ruthen ium platingtbe comparative pt~rforlllance studies of the alloys of complexRuthenium and Ruthenium, it was reported 131 tllat Ruthenium deposits bebave technically supl'riof. Inspite 9f As reported dsewhere, the authors wanted t prepare 25 gpl tbe numerous applications of Ruthenium as a deposit, ruthenium concentrate and inwstigate further. Accordingly, numerous sol utions have aIso he.en proposed ill the past. from the available basic AR grade Rutheniulll chloride Howevcr, all these were either unstable in oprration or it trihydrate sail (available only ali 1 g ampules, of SISCO gets plated [4,51 extcmally at low cathode curre-nt Research Lahora tory , Mumba i) was considered and furtber efficiencies. preparations Wfrt' carrkd oul as follows: In view of the non availahility of a good method for the A known amount of Ruthenium chloridl' salt was treatcd with pre-paration of a stahle Ruthcnium plating electrolyte the the required qualltity of AR l·onl'. hydrochloric acid and the prese-nt work was undertaken to arrive at a standard meUlOd required quantity of AR sulphamic acid, and tbe mixture was for Ule pfl'paration of the Ruthenium plating concentrate and hoilrd UI der renux for thirty hours to get the rutbenium to Sllidy its stability and also some of the characteristic chloride- sulpha mate complex with propcr diestion. When tbe propertie-s of the solution as well as of the deposits obtained Volume of the solution became 20 1111 (after cooling) it was therefrom. made upto a known Volume in a slandard volumetric llask, 238 VTSALAKSHI et al. - Asimple method for the preparation of ruthenium plating solution ego to 50 ml or 100 ml etc , so tbat tbe concentration of ruthenium could be fixed exactly. For example, 5 g, of the salt ruthenium cbloride containing 2 g of rutbenium may require 10 011 HCI and 1.5 g sulpbamic acid. All in total after the above evaporation and reflux tbe plating complex separated in 60% yield as dark red crystals. Further evaporation of tbe filtrate and cooling yielded 30% more of the product. When the solution is made upto 50 ml, the cone. of ruthenium sball be 40 gil. Sucb a solution concentrate is always preferahle for furtber preparation of plating d ctrolytes. Dilute solutions of this concentrate (4 ml made upto 50 ml) were used for plating operations. Experiments with different concentrations of ruthenium Various plating electrolytes were prl'.pared with different ruthenium conc.entrations for the volume of 50 ml, and various studies on tbe current efficiency, temperature, pH were carried out with different substrates like copper, Ni kel plated on copper, Nickel and then gold plated on copper. The size of the specimen was 1" x 5". A 1 x Sq" area of copper was exposed for plating. Effed of bath composition Different bath compositions were used for plating under conditions, as to optimise. the bath for further studies. Effect of current density Numerous investigations were carried out with the' standardised bath under different current densities so as to optimise it for obtaining a good deposit with higber current efficiency. Tbe current delisities used were 0.5 AIdm 2, 0.75 A/dm2 and 1 A/dm2 respectively. Effed of temperature Investigations were also carried out in the standardised bath at various current densities for different temperatures like 313, 323 and 333 K so as to identify tbe suitable temperature for further studies. Effect of pH The effect of pH on the characteristics of the plating solutions was studied with the standardised bath for different pH values of 1, 2, 3, 7, 8, and 9 under other standard conditions. Effect of substrate on deposition To see the effect of substrate on deposition experiments were carried out on different substrates like copper, nickel plated copper, gold plated copper (2 I-tm gold) so as to observe the cbange in tbe nature of the depo1\it on the various substrates. RESULTS AND DISCUSSION Characterisation of the ruthenium plating electrolyte The concentrate of Ruthenium complex, prepared as per tbe method described earlier in the experimental part, was made upto a known voluml' and the concentration of ruthenium in tbe above made up solution was 12 gil. Various concentrations of ruthenium for plating experiments were obtained by appropriate dilutions of the concentrate so as to get the concentration of ruthenium of 0.5, O.R and 1.0 gil respectively, and then other nec.cssary additions were made for further use. Results on the effect of concentration on current efficiency Table I contains the results of various experiments carried out using different e1l'ctrolytes, with different concentrations of Ruthenium. From the table it may be observed tbat tbe bath baving the Ruthenium conc.entration of 0.8 gil was able to produce a good, adherent, semi bright deposit with a considerahle current effidency of 51.0%, at 0.5 A/dm2 current density, at 333 K. Though the current efficiency of bath A, whicb contained 1 gil of Ruthenium ha1\ as high a current efficiency as 76.4% under the same operating conditions, the nature of the deposit was not satisfactory (Table I). Similarly, the ruthl'niulll deposit from bath C, (which containe.d 0.5 gil of Ruthenium, the nature of the deposit was not desirahle and the current efficiency of 25% was also the lowest. TABLE I: Effect of bath composition on the nature of deposit Current d~nsity = 0.5 A/dm2 Temper-BtuR = 333 K pH =],8 Time =15 millS Weight C.E. Nature Bath gElin (%) of (g) deposit Bath A 'Ru' as Ruthenium Chloride 1 gil HCI 100 gil Grey & Sulphamic acid 147 gil 0.0154 76.4 rough Bath B 'Ru' as Ruthenium Chloride 0.8 gil HCI 100 gil Semi Sulphamic acid 147 gil 0.0154 51.1 bright Bath C 'Ru' as Ruthenium Chloride 0.5 gil HO 100 gil Sulphamic acid 147 gil 0.0132 25.0 Patchy 239 VISALAKSHI et a!. - Asimple method for the preparation of ruthenium plating solution TABLE !V: Effect of time on the nature of deposit Temperature = 333 K C.D. = 0.5 A/dm! pH = 1.8 Time Current Nature Bath (mlns) (%) of deposit 'Ru' as Ruthenium Chloride 0.8 gil HQ 100 gil Sulphamic acid 147 gil 15 51.1 A 30 54.1 A 45 51.1 A 60 43.4 A 75 41.4 A 110 37.5 B 105 25.0 B 120 18.7 B A =Semi bright; B = Matte white like 1.8 or 2.0 may produce low e-urrent efficiencies of about 51 % the semi bright nature of the deposit is obtained, whereas al higher pH of 7 and beyond, it bee-omes black and powdery. Moreover, al high pH the solution tends to decompose. From the above observations, it is de.ar tbat a pH of 1.8 appears to be most favourable for obtaining good deposits, Effect of substrate on the nature of the deposit Table VI shows the results of tbe above studies. From the' table it may be observed that tbe current efficiency is more or less not alIected by tbe cbange of substrate but it has influence. on tbe nature of the deposit. On	 a copper substrate. with first nickel and tben gold overcoatings tbe nature of the deposit obtained was v('.ry good, viz, it was semibrighl. On a copper substrate tbe TABLE V: EIl"ect of pH on the nature of deposit Temp = 333 K C.D. = 0.5 A/dm! Time = 15 mins C.K Nature Bath	 pH (%) of deposit 'Ru' as Ruthenium Chloride 0.8 gil HCI 100 gil Sulphamic acid 147 gil 1.6 43.80 A 1.8 51.10 B 2.0­ 4780 B 2.2 4450 B 7.0 99.00 C 8.0 1l1l.25 C 1l.0 99.50 C A = Patcby; B = Semi bright; C = Black, powdery TABLE VI: Effect of substrate on the nature of deposit Bath = 'Ru' as ruthenium cbloride = 0.8 gil DC! =100 gil and sulphamic acid =147 gil Time = 15 mins Temp = 333 K pH = 1.8 Current Further Deposit Substrale emclency buildup nature (%) (g) Copper 54.1 Nil A Copper with nickel flash 43.8 0.0016 Grey Copper with nickel and gold fl~sb 51.1 0.0016 Semi bright Mild steel Pilling A	 = Non adht"rcnt, blackish deposit was not adherent, and on the mild steel pilling was observed. CONCLllSION From all the. above preliminary studies the following conclusions were drawn: 1.	 It is possible to prepare a Ruthenium electroplating bath concentrate from tbe basic salts like rutbenium cbloride (RuCI3 . 3HP), Ha, and sulpbamic acid. 2.	 The concentration of ruthenium in tbis bath is 12 grams per litre. 3.	 This cone-entrate can be stored for more tban six months without any decomposition and can be used for preparing plating baths witb different conccntra tions. 4.	 The plating batb was found to be stable for minimum 6 months witb the efficiency of producing good deposiL<; and maintaining the current efficiency. 5.	 The following electrolyte composition may be used for obta inillg a semibright of ruthenium 011 gold super coated copper SUbstrate, witb the current efficiency of 51 %. The method of preparation is also not hazardous. 6.	 The same plating electrolyte can be revived for use by fresh additions of the concentrate. REFERENCES 1.	 American Society of Metals, Metals Handbook Desk Edition, (1985) 2.	 F H Reid and J C Blake, Trans Inst Metal Finishing, (1961) 3.	 H C Angus, Trans Inst Metal Finishing, 43 (1965) 135 4.	 G S Reddy and P Taimsalu, Trans Inst Metal Finislling, 47 (t969) 187 5.	 M J ('Ieare and W P Griffith, Chem Comm, (1968) 1302 241 

A simple method for the preparation of ruthenium plating solution

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