He, Peng

Jia, Dechang

Lin, Tiesong

Sekulic, Dusan P.

Wang, Shengjin

Wei, Hongmei

Zhuang, Yanli

English

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8th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS)14–17 October 2016Seattle, Washington | Hosted by Purdue UniversitySESSION 4: WELDING AND COATING, SALON ECo-Chairs: Jun Qu, Oak Ridge National Laboratory; Yongping Lei, China Nuclear Power Design Company; Peng He, Harbin Institute of Technology; Yunlong Chang, Shenyang University of TechnologySATURDAY, OCTOBER 15, 2016Wetting and interfacial microstructure of porous Si3N4/Si3N4  joint after silver metallizationYanli Zhuang; Tiesong Lin; Shengjin Wang; Peng He, Harbin Institute of Technology; Dusan P. Sekulic,  University of Kentucky; Dechang Jia; Hongmei Wei, Harbin Institute of TechnologyABSTRACTIn order to improve the wettability of Ag–Cu–Ti filler on porous Si3N4 ceramic, a surface silver metalized modifi-cation of porous Si3N4 ceramic was achieved by the methods of immersion with AgNO3 solution and subsequent thermal decomposition processing. Then, the porous Si3N4/Si3N4 joint was brazed with Ag–Cu–Ti filler at 880°C for 10 min. Effect of silver metallization on the wettability and interface microstructure of joint were investigated in de-tail. After silver metallization, SEM results revealed that a large number of spherical silver particles were uniformly distributed on the surface of Si3N4 grains. The contact angle of filler on porous Si3N4 ceramic was changed from ∼8° to ∼6° after metallization; meanwhile, the filler infiltrated into the pores of ceramic surface with the thickness from ∼25 to ∼45 µm, which implied that silver metallization could promote filler into the pores of ceramic surface. The different morphologies of interface were also found in the process of brazing. It was observed that the joint without pre-silver-metallization exhibited single face infiltration with the layer thickness of ∼25 µm under the ac-tion of gravity, while both faces were infiltrated with the layer thickness of ∼60 µm after metallization. SEM results discovered that an ideal “ceramic parent material – infiltration layer – welding seam – infiltration layer – ceramic parent material” gradient structure of porous Si3N4/Si3N4 joint was obtained by using this method. In addition, the shear strength of the porous Si3N4/Si3N4 joint was significantly improved by metallization.KEYWORDS: porous Si3N4, silver metallization, wetting, interface

Wetting and interfacial microstructure of porous Si3N4/Si3N4 joint after silver metallization

https://docs.lib.purdue.edu/cgi/viewcontent.cgi?article=1042&amp;context=icpns

Wetting and interfacial microstructure of porous Si3N4/Si3N4 joint after silver metallization

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