Scanning electron acoustic microscopy (SEAM) and SEM infrared imaging (SEMIR) use both a modulated electron beam to generate thermal waves which produce acoustic waves detected by a transducer in the case of SEAM and affect the surface temperature which is directly monitored by the infrared emission. Both techniques are used to visualize non-adherence zones in III-V compounds devices. SEAM is applied to metallic layers like Au, Au-Ti, W-Mo-Ge deposited on a GaAs substrate. SEAM images are correlated with global adherence measurements.
SEMIR is applied to dielectric layers, like Si3N4/InP. An estimation of the surface temperature is given. Sensitivity and spatial resolution of both techniques are given and compared
