Abunjaileh, AI

Hizan, HM

Hunter, IC

Lucyszyn, S

Robertson, ID

Shafique, MF

English

Spiral - Imperial College Digital Repository

Millimeter-Wave Substrate-Integrated Circuits on Photo-imageable Substrate and LTCCIan Robertson (i.d.robertson@leeds.ac.uk)Hizamel M. Hizan, Ian C. Hunter, Alaa I. Abunjaileh, M. Farhan ShafiqueInstitute of Microwave and Photonics, University of LeedsStepan LucyszynImperial College London Recent Advances on Substrate Integrated Waveguide Filters :Simulations, Technologies and PerformancesPhotoimageable thick film technology“Rapid Prototyping” LTCC Technology using LPKF Laser Laser Machining of Microvias and Trenches Future Work:-Novel filter topologiesSIWs & AntennasSystems integrationOUTLINEBalunHigh Q L/CDivider/CombinerDuplexerAntennaIsolatorHigh Q ResonatorDriver LNAMixerVCOPASwitchMMICMCMMOTIVATIONTHICK-FILM TECHNOLOGY PURSUED FOR LOW COST FABRICATIONOF LARGE AREA SYSTEM-ON-SUBSTRATE APPLICATIONMULTILAYER PHOTOIMAGEABLETHICK FILM PROCESSPrint Dry Expose Develop FireConventional Thick FilmTechnologyExtra stepsMULTILAYER PHOTOIMAGEABLETHICK FILM PROCESS• Special type of photosensitive thick film material• Features are defined by exposure of dry paste to UV light• Gold, silver and dielectric pastes available• Rheology of paste can be optimised for smooth finish• Fine width/gap, easy to fabricate, low costCollimated UV LightDeveloper SystemExposureScreen Printing/Dry at 80oCFiringDevelopment0.1% MAELensPhoto-maskVia  ORConductorCoating  of Dielectric/MetalSubstrateSIW Fabrication• Conductor print defines ground plane• Dielectric layer exposed & developed to create vias for sidewalls• Conductor print forms guide sidewalls• Repeat dielectric prints to build guide height• Final conductor print forms upper broadwallFabricated waveguideLower broadwall Vias form sidewallsAlumina base substrateUpper broadwallTRL calibrationMeasurement reference planeThruReflectLine standards at λg/4 at start, end, and mid-frequencies of waveguide -40-30-20-1000 14 28 41 55 69 83 96 110Frequency (GHz)S21 MeasuredS11 MeasuredS21 Simulat edS11 Simulat edV band  waveguide back-to-back transition measuremen ts 00.10.20.30.40.50.60.70.80.950 53 56 59 63 66 69 72 75 80 85 90 95 100 105 110Frequency (GHz)Measured attenuation (dB/mm) for V and W-band wavegu ides.30µm height60µm heightInverter-coupled filterX1(ω) X2(ω)K12Xn(ω)Kn,n+1K01Rin Rout• Kij impedance inverters and Xn(ω)resonator sections are series connectedInverter• Inductive reactance readily realized by a H-plane offset• Displaced junction characterized in HFSSPort 1Port 2XLSIW filter synthesizedResonator sections, Xn(ω)Impedance inverters, Kij180 GHz Filter – Measured Results-60-50-40-30-20-100140 150 160 170 180 190 200 210 220Frequency (GHz)S21 MeasuredS11 MeasuredS21 SimulatedS11 SimulatedStephens, D.; Young, P.R.; Robertson, I.D., “Design and characterization of 180 GHz filters in photoimageable thick-film technology“ IEEE MTT-S IMS, 2005, vol. 1, pp. 451-454 W-band AntennaStephens, D.; Young, P.R.; Robertson, I.D. (2005) W-band substrate integrated waveguide slot antenna. Electronics Letters, 41(4), pp.165-167.Complete SIW/MMIC 60GHz Receiver 5.4 mmSMT Components/Bias NetworkCavity Resonator Band Pass Filter at 60 GHzSubstrate Integrated Waveguide Antenna at 60GHzMultilayer Embedded Low Pass  IF FilterWaveguide  to Microstrip TransitionMMIC (RF Amp. At  60GHz)MMIC (Mixer and IF Amp)LO Port(CPW)IF Port(CPW)22.5  mmMajor drawback of thick filmphotoimageable approach for SIWsWaveguide height!Even achieving 100 microns height requires many print-expose-fire cyclesAlignment becomes challengingLTCC ProcessLTCC prototyping using LPKF laser systemEquipment and Material• Protolaser 200 Nd:Yag Laser etching machine from LPKF• 943PX, 254 µm green tape from DuPont• HF612 silver paste from DuPont• HF600 via filling paste from DuPontSlide 22Via machiningSlide 24Mechanical drill and punchesLaser machiningLow capital cost High capital costSingle use Multipurpose Low punching rate High punching rateClean and precise diameter Not very clean, precision suffers Holes only Arbitrary shape possibleNo optimization required Hard to optimizeDirect contact with the materialNo direct contact with materialShort tool life Long life Minimum dimensionsSlide 25SIW with solid wall and via postsSlide 26Slide 27• Both solid walled (groove based) and via post SIW can achieve similar performanceFurther DevelopmentsNovel filter topologiesSIW / Antenna integrationHigher frequenciesNovel reconfigurable systemsSIW ResonatorInter-Resonator CouplingIdeal vs EMResonator#1 Resonator#2Resonator#3 Coupling between #1 & #261.4266mm 20.4855mm18.02mm 18.66mm18.55mm8.013mm 8.385mm 8.4156.1508mm1.0834mm 0.3980mm12LayoutSimulated responseResultsPhotograph of the fabricated filterMeasured responseBlock diagram Exploded viewINTEGRATED MICROWAVE FILTER AND ANTENNAPHOTOGRAPH OF FABRICATED INTEGRATED SIW FILTER AND MICROSTRIP ANTENNATop View Side ViewFabricated on Rogers Duroid6010 of εr=10.2SIMULATED AND MEASURED RESULTSSimulated MeasuredBasic RETINA concept is based on creating virtual s ide wallsusing optical illumination and the photoconductivit y effectThe RETINA conceptREconfigurable Terahertz INtegrated Architecture (RETINA)Y. Zhou and S. Lucyszyn, “Modelling of reconfigurabl e terahertz integrated architecture (RETINA) SIW structures”, EM Academy’s PIER Journal, vol. 105, pp. 71-92, Jun. 2010Beam Width = 50 µmWafer Thickness = 100 µmOptical Incident Power Range: 10-100 W/cm 2Silvaco™ TCAD simulations: 2D LuminousScanning phased Array Antenna Concept at 200 GHz Loss Comparison with Various SIW TechnologiesLTCC Microfluidic ChannelsImperial College, London, 15-3-01, 1mm Previous Imperial-Leeds collaboration in RF MEMS& Micromachined ComponentsCollaboration with Mechanical Engineering on Large Area Screen PrintingCeramic technologies are highly suited to the reali sation of SIW filters and circuitsTo go significantly beyond 100 GHz requires researc h into improved materials and fabrication techniquesIn LTCC, a wide range of microfluidic and mechanica l components can be integrated to form a truly multifunctional system-o n-substrateA major challenge for the next few years is to stud y the feasibility of realising screen-printed RF MEMS integrated with SIWs to  make tuneable filtersAddressing these challenges can lead to highly nove l large-area SIW-based systems ConclusionsAcknowledgmentsThis work is supported by the Science and Engineering Research Counciland by the Innovative Manufacturing Research Centre (IeMRC) based at Loughborough University.

Millimeter-wave substrate-integrated circuits on photo-imageable substrate and LTCC

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Millimeter-wave substrate-integrated circuits on photo-imageable substrate and LTCC

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