It is demonstrated here that growth stress has a substantial effect on the
dielectric constant of zirconia thin films. The correct combination of
parameters - phase, texture and stress - is shown to yield films with high
dielectric constant and best reported equivalent oxide thickness of 0.8 nm. The
stress effect on dielectric constant is twofold, firstly, by the effect on
phase transitions and secondly by the effect on interatomic distances. We
discuss and explain the physical mechanisms involved in the interplay between
the stress, phase changes and the dielectric constant in detail.Comment: 11 pages, 5 figure