3D silicon sensors, where plasma micro-machining is used to etch deep narrow
apertures in the silicon substrate to form electrodes of PIN junctions,
represent possible solutions for inner pixel layers of the tracking detectors
in high energy physics experiments. This type of sensors has been developed for
the Insertable B-Layer (IBL), an additional pixel layer that has been installed
in ATLAS during the present shutdown of the LHC collider at CERN. It is
presented here the experience in designing, testing and qualifying sensors and
detector modules that have been used to equip part of the IBL. Based on the
gained experience with 3D silicon sensors for the ATLAS IBL, we discuss
possible new developments for the upgrade of ATLAS and CMS at the
high-luminosity LHC (HL-LHC).Comment: 9 pages, 7 figures, conference proceedings for International Workshop
on Semiconductor Pixel Detectors for Particles and Imaging (PIXEL2014), will
be published on JINS
