Barber, RW

Desmulliez, MPY

Dhariwal, RS

Emerson, DR

Holmes, AS

Hong, G

Leonard, M

Pang, AJ

Pullen, KR

Rencz, M

Reuben, RL

Slattery, O

Waldron, F

The modelling, simulation, fabrication and testing of a microchannel cooling plate are described in this article. The device is to be used in microelectronic packaging cooling applications. The nickel-based micro-channel cooling plate is fabricated on a glass substrate using a two-layer electroforming process borrowed from the UV-LIGA (UV-Lithography, Electroforming, Replication) process. Forced convection of air or liquid is scheduled for this microchannel plate. The cooling plate has been tested using a custom-made rig to measure the flow pressure head as a function of mass flow rate. Hydraulic performance of the cooling plate is presented. © 2004 IEEE.</p

Heriot Watt Pure

Design, manufacture and testing of a low-cost micro-channel cooling device

Design, manufacture and testing of a low-cost micro-channel cooling device

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Heriot Watt Pure

Heriot Watt Pure