Sputter-deposited thin films of TiZrV are fully activated after 24 h "in situ" heating at 180 °C. This activation temperature is the lowest of some 18 different getter coatings studied so far, and it allows the use of the getter thin film technology with aluminium alloy vacuum chambers, which cannot be baked at temperatures higher than 200 °C.An updated review is given of the most recent results obtained on TiZrV coatings, covering the following topics: influence of the elemental composition and crystal structure on activation temperature, discharge gas trapping and degassing, dependence of pumping speed and surface saturation capacity on film morphology, ageing consequent to activation-air venting cycles and ultimate pressures. Furthermore, the results obtained when exposing a coated particle beam chamber to synchrotron radiation in a real accelerator environment (ESRF Grenoble) are presented and discussed
