Electron beam lithography (EBL) is a promising maskless solution for the
technology beyond 14nm logic node. To overcome its throughput limitation,
recently the traditional EBL system is extended into MCC system. %to further
improve the throughput. In this paper, we present E-BLOW, a tool to solve the
overlapping aware stencil planning (OSP) problems in MCC system. E-BLOW is
integrated with several novel speedup techniques, i.e., successive relaxation,
dynamic programming and KD-Tree based clustering, to achieve a good performance
in terms of runtime and solution quality. Experimental results show that,
compared with previous works, E-BLOW demonstrates better performance for both
conventional EBL system and MCC system