Ambat, Rajan

Conseil, Helene

Jellesen, Morten Stendahl

Piotrowska, Kamila

This manuscript gives a brief overview on the studies of thermal decomposition of solder flux systems commonly used in the electronic industry. Changes in chemical composition and structural changes of the flux components have been investigated as a function of temperature. Six weak organic acids, serving as flux activators, have been studied. Additionally, eleven industrially used solder flux systems have been investigated towards their thermal decomposition pattern. The results show the formation of additional species at high soldering temperatures, some having more aggressive nature than the initial flux components

Online Research Database In Technology

Corrosion reliability of electronics: the influence of solder temperature on the decomposition of flux activators

http://orbit.dtu.dk/ws/files/100370585/Corrosion_reliability_of_electronics.pdf

Corrosion reliability of electronics: the influence of solder temperature on the decomposition of flux activators

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Online Research Database In Technology