Ultrafast, dual common cathode, epitaxial rectifier diode in a SOT186A (TO-220F)) plastic package

General Description

Io(av A

Product Profile

Vf V

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1. Product proﬁle
1.1 General description
Ultrafast, dual common cathode, epitaxial rectiﬁer diode in a SOT78 (TO-220AB) plastic
package.
1.2 Features
1.3 Applications
1.4 Quick reference data
2. Pinning information
BYV34-600
Dual rectiﬁer diode ultrafast
Rev. 01 — 4 October 2007 Product data sheet
n Fast switching n Low thermal resistance
n Soft recovery characteristic n Low forward voltage drop
n Low switching loss n High thermal cycling performance
n Output rectiﬁers in high frequency
switched-mode power supplies
n Discontinuous Current Mode (DCM)
Power Factor Correction (PFC)
n VRRM £ 600 V n IO(AV) £ 20 A
n VF £ 1.16 V n trr £ 60 ns
Table 1. Pinning
Pin Description Simpliﬁed outline Symbol
1 anode 1
SOT78 (3-lead TO-220AB)
2 cathode
3 anode 2
mb mounting base; cathode
12
mb
3
sym084
3 1
2BYV34-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 4 October 2007 2 of 9
NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
3. Ordering information
4. Limiting values
5. Thermal characteristics
Table 2. Ordering information
Type number Package
Name Description Version
BYV34-600 TO-220AB plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead
TO-220AB
SOT78
Table 3. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VRRM repetitive peak reverse voltage - 600 V
VRWM crest working reverse voltage - 600 V
VR reverse voltage square waveform; d = 1.0;
Tmb £ 138 °C
- 600 V
IO(AV) average output current square waveform; d = 0.5;
Tmb £ 107 °C; both diodes conducting
-2 0 A
IFRM repetitive peak forward current t = 25 ms; square waveform; d = 0.5;
Tmb £ 107 °C; per diode
-2 0 A
IFSM non-repetitive peak forward
current
t = 10 ms; sinusoidal waveform; per
diode
- 120 A
t = 8.3 ms; sinusoidal waveform; per
diode
- 132 A
Tstg storage temperature -40 +150 °C
Tj junction temperature - 150 °C
Table 4. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-mb) thermal resistance from junction to
mounting base
with heatsink compound;
per diode; see Figure 1
- - 2.4 K/W
with heatsink compound;
both diodes conducting
- - 1.6 K/W
Rth(j-a) thermal resistance from junction to ambient in free air - 60 - K/WBYV34-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 4 October 2007 3 of 9
NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
6. Characteristics
Fig 1. Transient thermal impedance from junction to mounting base per diode as a function of pulse width
001aag912
10-1
10-2
1
10
Zth(j-mb)
(K/W)
10-3
tp (s)
10-6 11 0 10-1 10-2 10-5 10-3 10-4
tp
tp
T
P
t
T
d =
Table 5. Characteristics
Tj = 25 °C unless otherwise speciﬁed.
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
VF forward voltage IF = 10 A; Tj = 150 °C; see Figure 2 - 0.92 1.16 V
IF = 20 A; see Figure 2 - 1.07 1.48 V
IR reverse current VR = 600 V - 10 50 mA
VR = 600 V; Tj = 100 °C - 0.2 0.6 mA
Dynamic characteristics
Qr recovered charge IF =2At oV R ³ 30 V; dIF/ d t=2 0A / ms;
see Figure 3
- 4 07 0n C
trr reverse recovery time IF = 1 A to VR ³ 30 V;
dIF/dt = 100 A/ms; see Figure 3
- 5 06 0n s
IRM peak reverse recovery
current
IF = 10 A to VR ³ 30 V;
dIF/ d t=5 0A / ms; Tj = 100 °C;
see Figure 3
- 35A
VFR forward recovery
voltage
IF = 10 A; dIF/ d t=1 0A / ms;
see Figure 4
- 3.2 - VBYV34-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 4 October 2007 4 of 9
NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
(1) Tj = 150 °C; typical values
(2) Tj = 150 °C; maximum values
(3) Tj =2 5°C; maximum values
Fig 2. Forward current as a function of forward voltage
003aab485
0
5
10
15
20
25
30
0 0.4 0.8 1.2 1.6
VF (V)
IF 
(A)
(1) (2) (3)
Fig 3. Reverse recovery deﬁnitions Fig 4. Forward recovery deﬁnitions
001aab911
trr
time
100 %
10 %
IF
dlF
dt
IR IRM
Qr
001aab912
time
time
VFR
VF
IF
VFBYV34-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 4 October 2007 5 of 9
NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
IF(AV) =I F(RMS) ´Ö d a = form factor = IF(RMS) /I F(AV)
Fig 5. Forward power dissipation as a function of
average forward current; square waveform;
maximum values
Fig 6. Forward power dissipation as a function of
average forward current; sinusoidal waveform;
maximum values
003aab483
0
3
6
9
12
15
18
0 5 10 15
IF(AV) (A)
Ptot
 (W)
d = 1
0.5
0.2
0.1
003aab484
0
2
4
6
8
10
12
0369
IF(AV) (A)
Ptot
(W)
a = 1.57
 1.9
2.2
2.8
4.0BYV34-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 4 October 2007 6 of 9
NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
7. Package outline
Fig 7. Package outline SOT78 (3-lead TO-220AB)
 REFERENCES OUTLINE
VERSION
EUROPEAN
PROJECTION ISSUE DATE
 IEC  JEDEC  JEITA
 SOT78 SC-46 3-lead TO-220AB
D
D1
q
p
L
123
L1
b1
e e
b
0 5 10 mm
scale
Plastic single-ended package; heatsink mounted; 1 mounting hole;  3-lead TO-220AB SOT78
DIMENSIONS (mm are the original dimensions)
A E
A1
c
Q
L2
UNIT A1 b1 D1 e p
mm 2.54
qQ A b D c L2
max.
3.0 3.8
3.5
15.0
12.8
3.30
2.79
3.0
2.7
2.6
2.2
0.7
0.4
16.0
15.2
0.9
0.6
1.45
1.00
4.7
4.1
1.40
1.25
6.6
5.9
10.3
9.7
L1 E L
05-03-22
05-10-25
mounting
baseBYV34-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 4 October 2007 7 of 9
NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
8. Revision history
Table 6. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BYV34-600_1 20071004 Product data sheet - -BYV34-600_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 4 October 2007 8 of 9
NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Deﬁnitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
9.2 Deﬁnitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modiﬁcations or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the
full data sheet shall prevail.
9.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation speciﬁcations and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
speciﬁed use without further testing or modiﬁcation.
Limiting values — Stress above one or more limiting values (as deﬁned in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conﬂict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
10. Contact information
For additional information, please visit: http://www.nxp.com
For sales ofﬁce addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Deﬁnition
Objective [short] data sheet Development This document contains data from the objective speciﬁcation for product development.
Preliminary [short] data sheet Qualiﬁcation This document contains data from the preliminary speciﬁcation.
Product [short] data sheet Production This document contains the product speciﬁcation.NXP Semiconductors BYV34-600
Dual rectiﬁer diode ultrafast
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 4 October 2007
Document identifier: BYV34-600_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
11. Contents
1 Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . .  1
1.1 General description. . . . . . . . . . . . . . . . . . . . . .  1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
1.3 Applications  . . . . . . . . . . . . . . . . . . . . . . . . . . .  1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . .  1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . .  1
3 Ordering information. . . . . . . . . . . . . . . . . . . . .  2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . .  2
5 Thermal characteristics. . . . . . . . . . . . . . . . . . .  2
6 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . .  3
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .  6
8 Revision history. . . . . . . . . . . . . . . . . . . . . . . . .  7
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .  8
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .  8
9.2 Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
9.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
10 Contact information. . . . . . . . . . . . . . . . . . . . . .  8
11 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  9

Symbol Parameter Conditions Min Max Unit

http://www.nxp.com/documents/data_sheet/BYV34-600.pdf

Symbol Parameter Conditions Min Max Unit

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