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Study of the impact of the aspect ratio of etched silicon wafers on the ion angular distribution and ion energy distribution in pulsed plasma etching
Authors
Petit-Etienne C.
Cunge G.
Kogelschatz M.
Rochdi N.
Publication date
19 June 2023
Publisher
HAL CCSD
Abstract
International audienc
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oai:HAL:hal-04511461v1
Last time updated on 25/05/2024
