Ever decreasing of microelectronics devices is challenged by overheating and demands an increase
in heat removal rate. Herein, we fabricated highly efficient heat-removal coatings comprised of
copper oxide-plated polymer nanofiber layers (thorny devil nanofibers) with high surface-to-volume
ratio, which facilitate heat removal from the underlying hot surfaces. The electroplating time
and voltage were optimized to form fiber layers with maximal heat removal rate. The copper oxide
nanofibers with the thorny devil morphology yielded a superior cooling rate compared to the pure
copper nanofibers with the smooth surface morphology. This superior cooling performance is
attributed to the enhanced surface area of the thorny devil nanofibers. These nanofibers were characterized
with scanning electron microscopy, X-ray diffraction, atomic force microscopy, and a
thermographic camera