Liquid jet impingement cooling is an efficient cooling technique where the
liquid coolant is directly ejected from nozzles on the chip backside resulting
in a high cooling efficiency due to the absence of the TIM and the lateral
temperature gradient. In literature, several Si-fabrication based impingement
coolers with nozzle diameters of a few distributed returns or combination of
micro-channels and impingement nozzles. The drawback of this Si processing of
the cooler is the high fabrication cost. Other fabrication methods for nozzle
diameters for ceramic and metal. Low cost fabrication methods, including
injection molding and 3D printing have been introduced for much larger nozzle
diameters (mm range) with larger cooler dimensions. These dimensions and
processes are however not compatible with the chip packaging process flow. This
PhD focuses on the modeling, design, fabrication and characterization of a
micro-scale liquid impingement cooler using advanced, yet cost efficient,
fabrication techniques. The main objectives are: (a) development of a modeling
methodology to optimize the cooler geometry; (b) exploring low cost fabrication
methods for the package level impingement jet cooler; (c) experimental thermal
and hydraulic characterization and analysis of the fabricated coolers; (d)
applying the direct impingement jet cooling solutions to different
applications