Inductor Encapsulation-Based Thermal Management Enabling Increased Power Density

Abstract

Inductors occupy significant volume in dc-dc converters where power density is an important figure of merit. This research work addresses an improved design of a power-dense nanocrystalline-based inductor employing potting materials with high thermal conductivity. Contrary to traditional inductor design methods which require larger volumes to accommodate for temperature rise limits, this work presents an analytical framework to decrease the inductor volume through encapsulation. Particularly, it analyzes the effectiveness of employing a hybrid potting material, through experimental investigation of various filler compositions as compared to the classical silicone gel-based materials. Experimental evidence verifying the theoretically designed method is presented in this work.Fil: Christian, Shamar. University of Arkansas for Medical Sciences; Estados UnidosFil: Fantino, Roberto Armin. Consejo Nacional de Investigaciones Científicas y Técnicas. Centro Científico Tecnológico Conicet - Bahía Blanca. Instituto de Investigaciones en Ingeniería Eléctrica "Alfredo Desages". Universidad Nacional del Sur. Departamento de Ingeniería Eléctrica y de Computadoras. Instituto de Investigaciones en Ingeniería Eléctrica "Alfredo Desages"; ArgentinaFil: Amir Gomez, Roderick. University of Arkansas for Medical Sciences; Estados UnidosFil: Balda, Juan Carlos. University of Arkansas for Medical Sciences; Estados Unidos13th International Symposium on Power Electronics for Distributed Generation SystemsKielAlemaniaInstitute of Electrical and Electronics Engineer