International audienceIn the academic research activities in the cleanroom, where mass production is rarely required or substrate to be processed is sometimes limited in size, devices are often fabricated using diced chips rather than wafers. However, such fabrication often struggles to maintain quality, in part because of inhomogeneity on the small chip and the different chip size among users, which requires process optimization for each. One possible solution is to standardize processing chips attached to or embedded in a dummy wafer