Abdallah, Zeina

Baltopoulos, Athanasios

Blasakis, Nicolas

Kuball, Martin

Pomeroy, James W

Vavouliotis, Antonios

Thermal interface materials (TIM) are one of the key factors for an effective thermal management in packaged high-power electronic devices, hence the rapid growth of the TIM market. Novel TIMs based on nanoparticles are being developed to further ensure good heat conduction across interfaces in packages while ensuring a strong structural bond. Selecting the right thermal characterization technique for manufacturing feedback is challenging due to the lack of a widely accepted test method. In this work, low-frequency frequency domain thermoreflectance has been used to support material development and the process control of these novel nanoparticle-based TIMs

Characterization of a Novel Thermal Interface Material based on Nanoparticles for High Power Device Package Assembly

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