Microchip Analysis of Temperature and Humidity’s Effect on the Performance of Supply Voltage and Age

Abstract

Semiconductor chips are commonly duplicated overseas and sold on the black market, which causes product failures worldwide and diminishes the reputation of the companies involved in the supply chain. Currently, companies use a burn-in test: this test involves equipment that is used to test and evaluate high power chips, boards, or products. This prevents defective chips from being incorporated into any finished devices. While this method is quite common, the process will never eliminate the possibility of failed chips. Some are random and cannot be traced back to their failure cause. This research aims to determine how temperature and humidity affects a microchip at its different stages of life. This project will use a DOE, Design of Experiments, Analysis to determine the trend between temperature, humidity, VCC, chip-to-chip variation, age and how it affects, VOH, VOL, VIH, VIL, and power consumption. To test the hypothesis that an older chip leads to more failures and particular environment can detect a defective chip based on the input conditions of temperature, humidity, VCC, chip-to-chip variation, and age, this research will design an autonomous environment that will reduce the amount of failed chips that are used in production. The system will adjust and maintain the temperature and humidity of a chamber where the microchip will be tested. The chamber read accurately and precisely as well as the microchip voltage inputs and outputs. These results suggest that all values of VOH, VOL, VIH, VIL, and power consumption can be read, calculated, and recorded onto a DOE Analysis excel sheet to observe the results and produce the required graphs of temperature and humidity vs VOH, VOL, VIH, VIL, and power consumption

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