Photoimageable thick-film microwave structures up to 18 GHz

Abstract

The increasing interest in new wireless applications is creating demand for low cost, high performance microwave hybrid circuits. Offering the inherent advantages of thick-film technology such as low manufacturing costs and feasibility for mass production, recent improvements in thick film materials and processing techniques broadens the frequency range where ceramic thick-film circuits can be used and allow current thick-film technology to reach beyond its previous limitations and enter the domain reserved in the past for thin film technology. This paper discusses the advanced thick-film technique called photoimageable thick-film technology that uses photosensitive conductor and dielectric pastes and photoimaging as a method of patterning for manufacturing microwave hybrids operating in the frequency range up to 18 GHz