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挠性基板光电互联结构的热应力可靠性研究
Authors
于迪
李欣荣
+3 more
杨云
聂国健
雷庭
Publication date
1 January 2020
Publisher
《光通信研究》编辑部
Doi
Cite
Abstract
为了研究挠性光电互联结构在实际工程应用中的可靠性,建立了埋入光纤挠性基板光电互联结构有限元模型,根据光器件Telcordia GR-468标准加载热循环试验条件,对光电互联结构中的焊点应力、光纤应力和光电耦合效率进行仿真分析。热—结构仿真结果表明,焊点和光纤的最大等效应力均在安全范围内,光电耦合产生的最大损耗为0.7 dB,光电传输未受到显著影响,可以判定挠性光电互联结构在标准热循环作用下能够保证光电传输的稳定性
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Last time updated on 26/01/2023