Packaging design for low EMI generation of power modules

Abstract

International audienceThis paper investigates the impact of the design of a power module on its EMI generation, in the case of WBG components. Stray elements (inductances, capacitances) must be carefully reduced or designed, but that's not all: shielding effect and integrated filtering are also investigated. It results in some design rules for packaging. Some examples of power modules design will be presented

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