CORE
🇺🇦
make metadata, not war
Services
Services overview
Explore all CORE services
Access to raw data
API
Dataset
FastSync
Content discovery
Recommender
Discovery
OAI identifiers
OAI Resolver
Managing content
Dashboard
Bespoke contracts
Consultancy services
Support us
Support us
Membership
Sponsorship
Community governance
Advisory Board
Board of supporters
Research network
About
About us
Our mission
Team
Blog
FAQs
Contact us
Utilizing The Transparency Of Semiconductors Via Backside Machining With A Nanosecond 2 Μm Tm:Fiber Laser
Authors
Tobias Bonhoff
Christian Gaida
+3 more
Nils Gehlich
Mark Ramme
Laura Sisken
Publication date
1 January 2014
Publisher
'Information Bulletin on Variable Stars (IBVS)'
Abstract
Semiconductors such as Si and GaAs are transparent to infrared laser radiation with wavelengths \u3e1.2 μm. Focusing laser light at the back surface of a semiconductor wafer enables a novel processing regime that utilizes this transparency. However, in previous experiments with ultrashort laser pulses we have found that nonlinear absorption makes it impossible to achieve sufficient optical intensity to induce material modification far below the front surface. Using a recently developed Tm:fiber laser system producing pulses as short as 7 ns with peak powers exceeding 100 kW, we have demonstrated it is possible to ablate the backside surface of 500-600 μm thick Si and GaAs wafers. We studied laser-induced morphology changes at front and back surfaces of wafers and obtained modification thresholds for multipulse irradiation and surface processing in trenches. A significantly higher back surface modification threshold in Si compared to front surface is possibly attributed to nonlinear absorption and light propagation effects. This unique processing regime has the potential to enable novel applications such as semiconductor welding for microelectronics, photovoltaic, and consumer electronics. © 2014 SPIE
Similar works
Full text
Available Versions
University of Central Florida (UCF): STARS (Showcase of Text, Archives, Research & Scholarship)
See this paper in CORE
Go to the repository landing page
Download from data provider
oai:stars.library.ucf.edu:scop...
Last time updated on 18/10/2022