This thesis presents research into the mechanical and electrical characterisation of
Anisotropic Conductive Adhesive (ACA) particles and their behaviour within typical
joints. A new technique has been developed for study of individual ACA particle
mechanical and electrical performance when undergoing deformation. A study of the
effects of planarity variations on individual electrical joints in real ACA assemblies is
presented firstly, followed by the research on the mechanical deformation and electrical
tests of individual ACA particles undergoing deformation.
In the co-planarity research, experiments introducing deliberate rotation between
a chip and substrate were designed and carried out to simulate planarity variations
in ACA assemblies. There are two outputs from this part of the research. One is the
planarity variation effects on individual electrical joints in ACA assemblies, and the
other is the effect of bond thickness on the resistance of a real joint. [Continues.
