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从银—铜复合金属带材废料中回收金属的研究
Authors
吴建国
李希明
柯家骏
Publication date
1 January 1986
Publisher
Abstract
在电子行业中,各种电接插件广泛使用镀银层的铜合金为材料,因为银是电接触性能最优的一类材料。但随着电子工业的飞速发展,贵金属耗量剧增。为节约贵金属,近来已开始使用多种薄层贵金属的复合材料,即把作为电接触材料的贵金属(例如银)与具有良好机械性能和导电特性的贱金属(例如铜合金)以带材形式轧制复合在一起。由于在轧辊间产生的大轧制压力和变形热的同时作用下迫使两层
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Last time updated on 09/11/2016