Graphene Quantum Dots (GQDs) and epoxy have been combined into a nanocomposite and evaluated for their thermal and dynamic mechanical properties. Samples of varying GQD mass loading were first examined with SEM in several images. Thermal conductivity was estimated using Differential Scanning Calorimetry (DSC) with a step analysis technique and analysis program. Several dynamic mechanical properties were recorded using Dynamic Mechanical Analysis (DMA) and displayed in their raw and analyzed formats. For more insight please see Infusion of graphene quantum dots to modulate thermal conductivity and dynamic mechanical properties of polymers [1]

Erogbogbo, Folarin

Keles, Ozgur

Seibert, Joel R.

Wang, Jun

English

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San Jose State University SJSU ScholarWorks Faculty Research, Scholarly, and Creative Activity 2-1-2020 Data on thermal conductivity and dynamic mechanical properties of graphene quantum dots in epoxy Joel R. Seibert San Jose State University Ozgur Keles San Jose State University, ozgur.keles@sjsu.edu Jun Wang PerkinElmer, Inc. Folarin Erogbogbo San Jose State University, folarin.erogbogbo@sjsu.edu Follow this and additional works at: https://scholarworks.sjsu.edu/faculty_rsca Recommended Citation Joel R. Seibert, Ozgur Keles, Jun Wang, and Folarin Erogbogbo. "Data on thermal conductivity and dynamic mechanical properties of graphene quantum dots in epoxy" Data in Brief (2020). https://doi.org/10.1016/j.dib.2019.105008 This Article is brought to you for free and open access by SJSU ScholarWorks. It has been accepted for inclusion in Faculty Research, Scholarly, and Creative Activity by an authorized administrator of SJSU ScholarWorks. For more information, please contact scholarworks@sjsu.edu. Data ArticleData on thermal conductivity and dynamicmechanical properties of graphene quantumdots in epoxyJoel R. Seibert a, Ozgur Keles a, Jun Wang b,Folarin Erogbogbo a, *a Department of Biomedical, Chemical, and Materials Engineering, San Jose State University, 1 WashingtonSquare, San Jose, CA, 95112, United Statesb Thermal and Mechanical Characterization Lab, PerkinElmer, 75 Nicholson Ln, San Jose, CA, 95134, USAa r t i c l e i n f oArticle history:Received 15 November 2019Received in revised form 6 December 2019Accepted 10 December 2019Available online 21 December 2019Keywords:Graphene quantum dotsThermal conductivityDynamic mechanical analysisGraphene polymersDifferential scanning calorimetryGraphene nanoparticlesGraphene polymersa b s t r a c tGraphene Quantum Dots (GQDs) and epoxy have been combinedinto a nanocomposite and evaluated for their thermal and dynamicmechanical properties. Samples of varying GQD mass loading werefirst examined with SEM in several images. Thermal conductivitywas estimated using Differential Scanning Calorimetry (DSC) witha step analysis technique and analysis program. Several dynamicmechanical properties were recorded using Dynamic MechanicalAnalysis (DMA) and displayed in their raw and analyzed formats.For more insight please see Infusion of graphene quantum dots tomodulate thermal conductivity and dynamic mechanical proper-ties of polymers [1].© 2019 The Author(s). Published by Elsevier Inc. This is an openaccess article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).DOI of original article: https://doi.org/10.1016/j.polymer.2019.121988.* Corresponding author.E-mail address: Folarin.Erogbogbo@sjsu.edu (F. Erogbogbo).Contents lists available at ScienceDirectData in briefjournal homepage: www.elsevier .com/locate/dibhttps://doi.org/10.1016/j.dib.2019.1050082352-3409/© 2019 The Author(s). Published by Elsevier Inc. This is an open access article under the CC BY license (http://creativecommons.org/licenses/by/4.0/).Data in brief 28 (2020) 1050081. DataThe dataset contains raw files related to the manuscript, “Infusion of graphene quantum dots tomodulate thermal conductivity and dynamic mechanical properties of polymers [1]”. The raw dataobtained from for scanning electron microscopy was used in the construction, Differential scanningcalorimetry, thermal conductivity, and dynamic mechanical analysis.1.1. SEMSEM Images are found in the linked data repository in the SEM folder for E-GQD samples of withGQD mass loading of 0%, 1%, 2.5% and 5%. Images were taken with magnifications ranging from 100x-10000x.1.2. DSCThermal conductivity data analyzed by a program received from the University of Rostockthat wasused in research by Merzlyakov et al. is found in the linked data repository in the file TC.Combi-ned.xlsx [2].DSC was also used to verify the cure of the epoxy in samples, data related to this verification infound in the linked data repository in the file named epoxycurecombined.xlsx.1.3. DMARaw and analyzed data for DMA tests on samples with GQD mass loading of 0%, 1%, 2.5% and 5% arefound on the linked data repository in the file named combined.DMA.xlsx.Specifications TableSubject area Materials ScienceMore specific subject area Graphene nanocompositesType of data Tables and plotsHow data was acquired FEI XL30 ESEM TMPPerkin Elmer DMA-8000Perkin Elmer DSC-8500Data format Raw and AnalyzedExperimental factors Dispersement, degassing, curing temperature and time.Experimental features Nanocomposite fabrication, SEM, TEM, DSC, DMAData source location Thermal and Mechanical Characterization Lab, PerkinElmer, 75 Nicholson Ln, San Jose,CA 95134Data accessibility https://figshare.com/s/db2e99cbb17ec8fc5481https://drive.google.com/open?id¼1w4pX7BrSwf5zrJxIoItv1Vrk3fxBssgfRelated research article Author's name: Seibert JR, Keleş €O, Wang J, Erogbogbo F.Title: Infusion of graphene quantum dots to modulate thermal conductivity anddynamic mechanical properties of polymersJournal: Polymer. 2019; 121988.https://doi.org/10.1016/j.polymer.2019.121988Value of the Data Shows improved properties with addition of Graphene Quantum Dots (GQDs) in a nanocomposite when compared toother graphemic nanocomposites. Validates method of estimating thermal conductivity using DSC. Provides insight to the thermal and mechanical mechanisms of GQD/Epoxy composite properties.J.R. Seibert et al. / Data in brief 28 (2020) 10500822. Experimental design, materials, and methods2.1. TEMTEM images were obtained using Hitachi H-9500 System at 300 kV in a bright field mode at NASAAmes. Drops of GQD solution were on lacey carbon 300 mesh grids, which then were dried at roomtemperature for 20minutes to remove any liquid from the GQDs. Images takenwith the TEMwere usedto verify the structure of GQDs and compare to the bird charcoal source material.2.2. SEMFractured GQD/Epoxy composite samples were examined under SEM using the FEI XL30 ESEM TMPat NASA Ames. The SEMwas used in low vacuumwater mode, with a 15 kV beam. GQD/Epoxy samplesof 1%, 2.5%, 5% and neat epoxy were made using the DMA procedure but were fractured using ahammer and a vice, the fracture surface was examined in the SEM.2.3. DSCThermal conductivity was measured using DSC with the method previously mentioned research byMerzlyakov et al. in a program received from the University of Rostock available at http://www.polymerphysik.uni-rostock.de/research/research.php. Measuring thermal conductivity using DSCrequires additional sample preparation and a modulated temperature scan. This technique isconsidered an estimation which is within 5% of the actual thermal conductivity. A Perkin ElmerDSC-8500 dual furnace DSC was used for this experiment. A temperature step profile was used witha starting temperature of 40 C with 1 C heating steps at a rate of 75 C/min, with 1 min isothermic holdswith 5 repetitions steps to a final temperature of 45 C. First, the temperature profile was run andmeasured with an empty furnace and reference furnace to establish a baseline. Then the profile wasrunwith two different sapphire standards one of which has amass at least double the other standard asspecified in the manual for the software obtained from University of Rostock.Samples were cast into DSC pans with diameter approximately 6.5 mm and then sanded andpolished to approximately 0.50 mmwith 600 grit sandpaper. After samples had been polished, a smallamount of high temperature silicone Apiezon H grease was applied for good thermal contact with theDSC. Once samples had been measured with the step profile, the program from University of Rostockwas used to calculate the thermal conductivity and heat capacity using the method described in theliterature review of Merzlyakov et al.’s research.2.4. DMADynamic Mechanical Analysis was performed at PerkinElmer in 3-point bend configuration usingthe PerkinElmer DMA-8000. Samples for DMAwere cast into the previously mentioned mold. Sampleswere carefully removed from themold. Samples for DMAwere tested in the 3-point bend configurationin a PerkinElmer DMA 8000. Samples were tested at 1 cycle per second and a strain of .0050 mm.Analysis of the mechanical response measured by DMA using PerkinElmer software gave a calculatedstorage modulus and glass transition temperature. Glass transition temperature for DSC and DMAdiffer in that DSC measures when the endothermic or exothermic phase change occurs, whereas DMAmeasures when the solid behaves like a glass.AcknowledgmentsThework leading to this manuscript resulted from the efforts of Hildegarde Bell, Anesh Tilwani, JoseAlvarez, BelqaisNagshibandi, Navathej Gobi, Darshan Vijayakumar, Sowba. The work leading to theseJ.R. Seibert et al. / Data in brief 28 (2020) 105008 3results received funding from SJSU Research and Creativity Program, NSF I-Corps program throughCSUPERB.Conflict of interestThe authors declare that they have no known competing financial interests or personal relation-ships that could have appeared to influence the work reported in this paper.References[1] J.R. Seibert, €O. Keleş, J. Wang, F. Erogbogbo, Infusion of graphene quantum dots to modulate thermal conductivity anddynamic mechanical properties of polymers, Polymer (2019) 121988, https://doi.org/10.1016/j.polymer.2019.121988.[2] M. Merzlyakov, C. Schick, Thermal conductivity from dynamic response of DSC, Thermochim. Acta 377 (2001) 183e191,https://doi.org/10.1016/S0040-6031(01)00553-6.J.R. Seibert et al. / Data in brief 28 (2020) 1050084

Data on thermal conductivity and dynamic mechanical properties of graphene quantum dots in epoxy

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Data on thermal conductivity and dynamic mechanical properties of graphene quantum dots in epoxy

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