In accordance with one embodiment of the present invention, an apparatus of moderate cost is provided which can readily releasably connect an integrated
circuit to a circuit board. The apparatus includes a
socket that can be readily mounted on the circuit board, the socket forming a largely rectangular cavity which
closely receives the integrated circuit. The socket has a
lower portion forming vertical through slots, each slot
extending parallel to one of the sides of the rectangular socket. An elongated vertically-compressible interface
device lies in each of the slots, each interface device
having a row of compressible conductors with upper ends pressing against conductive pads on the underside
of the integrated circuit, and each compressible conduc
tor having a lower end pressing against a conductive
trace on the circuit board. A cover or the like mounts
on the socket and presses the integrated circuit down
wardly into the socket, to compress the interface de
vices to interconnect the integrated circuit to the circuit
board
