Digital image correlation (DIC) is a powerful, length-scale-independent methodology for examining full-field surface deformations. Recently, it has become possible to combine DIC with scanning electron microscopy (SEM), enabling the investigation of small-scale deformation mechanisms such as the strains accommodated within grains in polycrystalline metals, or around micro-scale constituents in composite materials. However, there exist significant challenges that need to be surmounted before the combination of DIC and SEM (here termed SEM-DIC) can be fully exploited. One of the primary challenges is the ability to pattern specimens at microstructural length scales with a random, isotropic and high contrast pattern needed for DIC. This paper provides a thorough survey of small-scale patterning methods for SEM-DIC and discusses their advantages and disadvantages for different applications.Peer Reviewedhttp://deepblue.lib.umich.edu/bitstream/2027.42/90784/1/0957-0233_22_12_125501.pd
