Future developments lead to increasing demands on mechatronic integrated devices (MID). Therefore, ceramics have to be used as substrate material and conductor tracks have to be located in the interior of components to be sufficiently protected. A process combination of vat photopolymerization (VPP-LED) and vacuum die casting is investigated for realizing such structures. First, optimized process parameters are derived by studying the filling behavior of straight capillaries. Subsequently, the results are transferred to complex additively manufactured substrates to derive design guidelines
